Inventor · disambiguated record
Fengsheng Xi
Also filed as: XI FENGSHENG
22 granted patents·2 pending applications·31 citations·filing 2016–2025
93Inventor score
Files withNINGBO SUNNY OPOTECH CO LTD24
Top patents by PatentIndex Score
24 records- 0197US9826132B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Nov 21, 2017·14 cites·24 claims
- 0294US9906700B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Feb 27, 2018·6 cites·30 claims
- 0393US9781325B1Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Oct 3, 2017·5 cites·20 claims
- 0491US11729483B2Photosensitive component, and camera module and manufacturing method thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Granted Aug 15, 2023·1 cites·12 claims
- 0588US10578837B2Molded photosensitive assembly for array imaging module for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Mar 3, 2020·1 cites·8 claims
- 0685US10321028B2Photosensitive assembly and camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jun 11, 2019·3 cites·31 claims
- 0781US12298533B2Manufacturing method of a molded photosensitive assembly for an array imaging moduleNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Granted May 13, 2025·0 cites·15 claims
- 0879US10126519B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Nov 13, 2018·1 cites·24 claims
- 0976US11822099B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Nov 21, 2023·0 cites·11 claims
- 1075US2025301815A1Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assemblyNINGBO SUNNY OPOTECH CO LTD·Filed 2025·Application pending·0 cites
- 1174US2020218034A1Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method ThereofNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Application pending·0 cites
- 1266US11627239B2Photosensitive assembly and camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 1365US11451693B2Camera module and molding circuit board assembly, circuit board and application thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2021·Granted Sep 20, 2022·0 cites·20 claims
- 1463US10908324B2Molded photosensitive assembly of array imaging moduleNINGBO SUNNY OPOTECH CO LTD·Filed 2016·Granted Feb 2, 2021·0 cites·5 claims
- 1563US10274694B2Manufacturing method of a molded photosensitive assembly of an array imaging moduleNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·23 claims
- 1663US10175447B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jan 8, 2019·0 cites·24 claims
- 1762US10582097B2Photosensitive assembly and camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2019·Granted Mar 3, 2020·0 cites·23 claims
- 1862US10033913B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jul 24, 2018·0 cites·4 claims
- 1960US12408465B2Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assemblyNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Sep 2, 2025·0 cites·18 claims
- 2056US11388320B2Photosensitive component, and camera module and manufacturing method thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jul 12, 2022·0 cites·18 claims
- 2154US11906879B2Camera module, molded photosensitive assembly and manufacturing method thereof, and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Feb 20, 2024·0 cites·20 claims
- 2254US11039052B2Camera module and molding circuit board assembly, circuit board and application thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2018·Granted Jun 15, 2021·0 cites·19 claims
- 2341US11223751B2Photosensitive assembly and camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Jan 11, 2022·0 cites·8 claims
- 2439US10148859B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Dec 4, 2018·0 cites·21 claims
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