Inventor · disambiguated record
Abu K. Eghan
Also filed as: EGHAN ABU K
3 granted patents·143 citations·filing 2001–2006
76Inventor score
Files withXILINX INC3
Top patents by PatentIndex Score
3 records- 0190US7061102B2High performance flipchip package that incorporates heat removal with minimal thermal mismatchXILINX INC·Filed 2001·Granted Jun 13, 2006·76 cites·10 claims
- 0287US7701070B1Integrated circuit and method of implementing a contact pad in an integrated circuitXILINX INC·Filed 2006·Granted Apr 20, 2010·19 cites·20 claims
- 0387US7064450B1Semiconductor die with high density offset-inline bond arrangementXILINX INC·Filed 2004·Granted Jun 20, 2006·48 cites·13 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →