Inventor · disambiguated record
Hsiao-Yun Chen
Also filed as: CHEN HSIAO-YUN
13 granted patents·6 pending applications·63 citations·filing 2011–2023
86Inventor score
Top patents by PatentIndex Score
19 records- 0192US9576929B1Multi-strike process for bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 21, 2017·9 cites·20 claims
- 0292US8375103B2System and method for file access and sharingD LINK CORP·Filed 2011·Granted Feb 12, 2013·50 cites·12 claims
- 0370US10684649B2Display deviceQISDA CORP·Filed 2019·Granted Jun 16, 2020·1 cites·12 claims
- 0468US9978709B2Solder bump stretching method for forming a solder bump joint in a deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 22, 2018·1 cites·20 claims
- 0563US9475145B2Solder bump joint in a device including lamellar structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 25, 2016·1 cites·20 claims
- 0656US11364280B2Method for blocking stress-induced tumor progressionTAIPEI VETERANS GENERAL HOSPITAL·Filed 2019·Granted Jun 21, 2022·0 cites·2 claims
- 0756US10816718B2Display device and assembling method thereofQISDA CORP·Filed 2019·Granted Oct 27, 2020·0 cites·16 claims
- 0855US9075892B2Method for automatically inserting an embedded toolbar into a web browser directly by way of a gateway deviceLIN CHIH-CHIANG·Filed 2011·Granted Jul 7, 2015·1 cites·7 claims
- 0954US2024096861A1Semiconductor package assemblyMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1052US10983266B2Light bar and display deviceQISDA CORP·Filed 2019·Granted Apr 20, 2021·0 cites·8 claims
- 1152US10068868B2Multi-strike process for bonding packages and the packages thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 4, 2018·0 cites·20 claims
- 1251US2023046413A1Semiconductor package assemblyMEDIATEK INC·Filed 2022·Application pending·0 cites
- 1350US2023260977A1Semiconductor packagesMEDIATEK INC·Filed 2022·Application pending·0 cites
- 1440US10229901B2Immersion interconnections for semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 12, 2019·0 cites·20 claims
- 1539US2013221074A1Solder bump stretching methodWEI CHENG-CHANG·Filed 2012·Application pending·0 cites
- 1638US10884289B2Backlight moduleQISDA CORP·Filed 2019·Granted Jan 5, 2021·0 cites·25 claims
- 1738US9292614B2Method for transmitting information between multiple electronic pagesLIN CHIH-CHIANG·Filed 2011·Granted Mar 22, 2016·0 cites·1 claims
- 1837US2014223364A1Method and device for creating direct index of contentMIIICASA TAIWAN INC·Filed 2013·Application pending·0 cites
- 1934US2012259964A1Cloud computing method capable of hiding real file pathsLIN CHIH-CHIANG·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →