Inventor · disambiguated record
Fumihisa Miyasaka
Also filed as: MIYASAKA FUMIHISA
3 granted patents·2 citations·filing 2011–2015
50Inventor score
Top patents by PatentIndex Score
3 records- 0168US9497863B2Wiring substrate and method of making wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Nov 15, 2016·2 cites·11 claims
- 0236US8587104B2Wiring board and semiconductor packageMIYASAKA FUMIHISA·Filed 2011·Granted Nov 19, 2013·0 cites·15 claims
- 0334US9560768B2Wiring substrate and method of making wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 31, 2017·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →