Inventor · disambiguated record
Bunshi Kuratomi
Also filed as: KURATOMI BUNSHI
12 granted patents·5 pending applications·63 citations·filing 2003–2011
89Inventor score
Files withRENESAS TECH CORP7KURATOMI BUNSHI5RENESAS E JP SEMICONDUCTOR INC2EASTERN JAPAN SEMICONDUCTOR TE1KAWATA YOUICHI1
Top patents by PatentIndex Score
17 records- 0173US7377031B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2005·Granted May 27, 2008·4 cites·3 claims
- 0271US6797542B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Sep 28, 2004·18 cites·7 claims
- 0370US7445969B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Nov 4, 2008·4 cites·3 claims
- 0468US7176060B2Integrated circuit card and a method of manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Feb 13, 2007·17 cites·12 claims
- 0565US7681308B2Fabrication method of semiconductor integrated circuit deviceRENESAS E JP SEMICONDUCTOR INC·Filed 2008·Granted Mar 23, 2010·2 cites·5 claims
- 0665US7037760B2Fabrication method of semiconductor integrated circuit deviceRENESAS E JP SEMICONDUCTOR INC·Filed 2003·Granted May 2, 2006·9 cites·19 claims
- 0764US8119050B2Method of manufacturing a semiconductor deviceKURATOMI BUNSHI·Filed 2005·Granted Feb 21, 2012·4 cites·8 claims
- 0862US8117742B2Fabrication method of semiconductor integrated circuit deviceKURATOMI BUNSHI·Filed 2010·Granted Feb 21, 2012·1 cites·8 claims
- 0952US7288440B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Oct 30, 2007·4 cites·20 claims
- 1045US2006216867A1Method of manufacturing a semiconductor deviceKAWATA YOUICHI·Filed 2006·Application pending·0 cites
- 1144US2008173995A1Memory card and manufacturing method of the sameRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 1242US7632720B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Dec 15, 2009·0 cites·10 claims
- 1340US2009160084A1Manufacturing method of semiconductor deviceKURATOMI BUNSHI·Filed 2006·Application pending·0 cites
- 1440US2008020510A1Fabrication method of semiconductor deviceKURATOMI BUNSHI·Filed 2007·Application pending·0 cites
- 1538US2005106786A1Method of manufacturing a semiconductor deviceFiled 2004·Application pending·0 cites
- 1636US8476113B2Method of manufacturing semiconductor deviceKURATOMI BUNSHI·Filed 2011·Granted Jul 2, 2013·0 cites·16 claims
- 1733US7144755B2Fabrication method of semiconductor integrated circuit deviceEASTERN JAPAN SEMICONDUCTOR TE·Filed 2004·Granted Dec 5, 2006·0 cites·6 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →