Inventor · disambiguated record
Akihisa Murata
Also filed as: MURATA AKIHISA
29 granted patents·7 pending applications·451 citations·filing 1992–2019
97Inventor score
Top patents by PatentIndex Score
36 records- 0192US6410207B1Positive photosensitive composition, positive photosensitive lithographic printing plate and method for making positive photosensitive lithographic printing plateMITSUBISHI CHEM CORP·Filed 2000·Granted Jun 25, 2002·24 cites·40 claims
- 0290US6903898B2Pressure-sensitive adhesive label for hard disk driveNITTO DENKO CORP·Filed 2002·Granted Jun 7, 2005·30 cites·12 claims
- 0389US6998175B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2001·Granted Feb 14, 2006·42 cites·11 claims
- 0488US6326122B1Positive photosensitive composition, positive photosensitive lithographic plate and method for making positive photosensitive lithographic printing plateMITSUBISHI CHEM CORP·Filed 1997·Granted Dec 4, 2001·36 cites·31 claims
- 0587US5814431APhotosensitive composition and lithographic printing plateMITSUBISHI CHEM CORP·Filed 1997·Granted Sep 29, 1998·44 cites·22 claims
- 0686US6488803B2Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the sameNITTO DENKO CORP·Filed 2001·Granted Dec 3, 2002·37 cites·6 claims
- 0785US6074802APositive photosensitive composition, positive photosensitive lithographic printing plate and method for its treatmentMITSUBISHI CHEM CORP·Filed 1998·Granted Jun 13, 2000·36 cites·21 claims
- 0884US8436481B2Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheetHOSHINO SHINJI·Filed 2010·Granted May 7, 2013·11 cites·6 claims
- 0984US7811647B2Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2005·Granted Oct 12, 2010·11 cites·9 claims
- 1082US7175728B2Heat-peelable adhesive sheetNITTO DENKO CORP·Filed 2005·Granted Feb 13, 2007·7 cites·4 claims
- 1182US5290883AEpoxy resin composition, cured product obtained therefrom, curing method therefor, and bonding method using the compositionNITTO DENKO CORP·Filed 1992·Granted Mar 1, 1994·40 cites·14 claims
- 1278US7718257B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2001·Granted May 18, 2010·14 cites·6 claims
- 1375US9597745B2Constricting nozzle and TIG welding torch using this nozzleMURATA AKIHISA·Filed 2012·Granted Mar 21, 2017·4 cites·6 claims
- 1471US7163597B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2003·Granted Jan 16, 2007·14 cites·4 claims
- 1568US6808861B1Positive photosensitive composition positive photosensitive lithographic printing plate and method for making positive photosensitive lithographic printing plateMITSUBISHI CHEM CORP·Filed 2001·Granted Oct 26, 2004·4 cites·16 claims
- 1665US6200727B1Positive photosensitive composition, positive photosensitive lithographic printing plate and method for forming a positive imageMITSUBISHI CHEM CORP·Filed 1999·Granted Mar 13, 2001·29 cites·22 claims
- 1764US7196867B2Pressure-sensitive adhesive label for hard disk driveNITTO DENKO CORP·Filed 2004·Granted Mar 27, 2007·3 cites·9 claims
- 1863US7067030B2Heat-peelable adhesive sheetNITTO DENKO CORP·Filed 2003·Granted Jun 27, 2006·7 cites·6 claims
- 1962US2007104913A1Pressure-sensitive adhesive label for hard disk driveNONAKA TAKAHIRO·Filed 2006·Application pending·0 cites
- 2061US7029550B2Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the sameNITTO DENKO CORORATION·Filed 2001·Granted Apr 18, 2006·8 cites·7 claims
- 2160US5738974APhotopolymerizable composition and photosensitive lithographic printing plateMITSUBISHI CHEM CORP·Filed 1995·Granted Apr 14, 1998·26 cites·10 claims
- 2258US7214424B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2002·Granted May 8, 2007·6 cites·10 claims
- 2356US8409884B2Process for producing organic electroluminescent panelHIRAYAMA TAKAMASA·Filed 2009·Granted Apr 2, 2013·1 cites·6 claims
- 2454US7147743B2Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the sameNITTO DENKO CORP·Filed 2001·Granted Dec 12, 2006·4 cites·7 claims
- 2551US10219054B2Protective member for acoustic component and waterproof caseNITTO DENKO CORP·Filed 2013·Granted Feb 26, 2019·0 cites·16 claims
- 2650US8475600B2Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatusUENDA DAISUKE·Filed 2006·Granted Jul 2, 2013·0 cites·9 claims
- 2750US2007111392A1Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit boardNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2848US8524007B2Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatusUENDA DAISUKE·Filed 2010·Granted Sep 3, 2013·0 cites·8 claims
- 2945US5849463APhotosensitive compositionMITSUBISHI CHEM CORP·Filed 1997·Granted Dec 15, 1998·11 cites·14 claims
- 3043US12097579B2TIG welding torch equipped with narrow nozzle for spot welding, and electrode nozzle used in sameMURATA WELDING LABORATORIES INCORPORATED·Filed 2019·Granted Sep 24, 2024·0 cites·14 claims
- 3141US2021179893A1Shaping-stage adhesive sheet and lamination shaping deviceNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 3240US2004177918A1Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit boardFiled 2002·Application pending·0 cites
- 3339US2020009789A1Build matNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 3437US2013260120A1Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 3531US5427887ALight-sensitive compositionKONISHIROKU PHOTO IND·Filed 1993·Granted Jun 27, 1995·2 cites·9 claims
- 3630US2013330546A1Heat-peelable adhesive sheetTAKAMI Yoshihito·Filed 2012·Application pending·0 cites
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