Inventor · disambiguated record
Edmund J. Sprogis
Also filed as: SPROGIS EDMUND · SPROGIS EDMUND J · SPROGIS EDMUND JURIS
112 granted patents·17 pending applications·4,011 citations·filing 1987–2017
99Inventor score
Top patents by PatentIndex Score
129 records- 0199US7557597B2Stacked chip securityIBM·Filed 2005·Granted Jul 7, 2009·231 cites·8 claims
- 0299US7402442B2Physically highly secure multi-chip assemblyIBM·Filed 2005·Granted Jul 22, 2008·243 cites·7 claims
- 0399US7193423B1Wafer-to-wafer alignmentsIBM·Filed 2005·Granted Mar 20, 2007·231 cites·4 claims
- 0499US6507115B2Multi-chip integrated circuit moduleIBM·Filed 2000·Granted Jan 14, 2003·312 cites·22 claims
- 0599US5977640AHighly integrated chip-on-chip packagingIBM·Filed 1998·Granted Nov 2, 1999·585 cites·13 claims
- 0698US9654004B13D integrated DC-DC power convertersIBM·Filed 2016·Granted May 16, 2017·22 cites·10 claims
- 0798US7768005B2Physically highly secure multi-chip assemblyIBM·Filed 2008·Granted Aug 3, 2010·73 cites·17 claims
- 0898US7488680B2Conductive through via process for electronic device carriersIBM·Filed 2005·Granted Feb 10, 2009·87 cites·11 claims
- 0998US6279815B1Stacked chip process carrierIBM·Filed 2000·Granted Aug 28, 2001·254 cites·11 claims
- 1097US7781781B2CMOS imager array with recessed dielectricIBM·Filed 2006·Granted Aug 24, 2010·65 cites·11 claims
- 1197US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 1296US6265771B1Dual chip with heat sinkIBM·Filed 1999·Granted Jul 24, 2001·209 cites·6 claims
- 1395US7563714B2Low resistance and inductance backside through vias and methods of fabricating sameIBM·Filed 2006·Granted Jul 21, 2009·35 cites·10 claims
- 1494US7361989B1Stacked imager packageIBM·Filed 2006·Granted Apr 22, 2008·26 cites·11 claims
- 1594US5935763ASelf-aligned pattern over a reflective layerIBM·Filed 1996·Granted Aug 10, 1999·213 cites·18 claims
- 1693US7435627B2Techniques for providing decoupling capacitanceIBM·Filed 2005·Granted Oct 14, 2008·18 cites·11 claims
- 1793US6627477B1Method of assembling a plurality of semiconductor devices having different thicknessIBM·Filed 2000·Granted Sep 30, 2003·68 cites·26 claims
- 1893US6294406B1Highly integrated chip-on-chip packagingIBM·Filed 1999·Granted Sep 25, 2001·120 cites·10 claims
- 1992US9806615B1On-chip DC-DC power converters with fully integrated GaN power switches, silicon CMOS transistors and magnetic inductorsIBM·Filed 2016·Granted Oct 31, 2017·7 cites·18 claims
- 2092US7932614B2Method of thinning a semiconductor substrateIBM·Filed 2010·Granted Apr 26, 2011·12 cites·11 claims
- 2192US4801869ASemiconductor defect monitor for diagnosing processing-induced defectsIBM·Filed 1987·Granted Jan 31, 1989·70 cites·16 claims
- 2291US9355936B2Flattened substrate surface for substrate bondingGLOBALFOUNDRIES INC·Filed 2014·Granted May 31, 2016·16 cites·20 claims
- 2391US8785289B2Integrated decoupling capacitor employing conductive through-substrate viasIBM·Filed 2013·Granted Jul 22, 2014·11 cites·18 claims
- 2491US8138036B2Through silicon via and method of fabricating sameANDRY PAUL STEPHEN·Filed 2008·Granted Mar 20, 2012·18 cites·16 claims
- 2591US7348210B2Post bump passivation for soft error protectionIBM·Filed 2005·Granted Mar 25, 2008·25 cites·5 claims
- 2691US6635970B2Power distribution design method for stacked flip-chip packagesIBM·Filed 2002·Granted Oct 21, 2003·61 cites·20 claims
- 2790US8558345B2Integrated decoupling capacitor employing conductive through-substrate viasKIM TAE HONG·Filed 2009·Granted Oct 15, 2013·18 cites·9 claims
- 2890US7851923B2Low resistance and inductance backside through vias and methods of fabricating sameIBM·Filed 2009·Granted Dec 14, 2010·16 cites·15 claims
- 2990US6225699B1Chip-on-chip interconnections of varied characteristicsIBM·Filed 1998·Granted May 1, 2001·98 cites·32 claims
- 3089US7645701B2Silicon-on-insulator structures for through via in silicon carriersIBM·Filed 2007·Granted Jan 12, 2010·15 cites·16 claims
- 3189US7521798B2Stacked imager packageIBM·Filed 2007·Granted Apr 21, 2009·13 cites·10 claims
- 3288US8637937B2Through silicon via for use in integrated circuit chipsANDRY PAUL STEPHEN·Filed 2012·Granted Jan 28, 2014·7 cites·16 claims
- 3388US8198734B2Silicon-on-insulator structures for through via in silicon carriersANDERSON BRENT A·Filed 2009·Granted Jun 12, 2012·14 cites·12 claims
- 3488US7678696B2Method of making through wafer viasIBM·Filed 2008·Granted Mar 16, 2010·16 cites·20 claims
- 3588US6429045B1Structure and process for multi-chip chip attach with reduced risk of electrostatic discharge damageIBM·Filed 2001·Granted Aug 6, 2002·74 cites·15 claims
- 3687US7488624B2Techniques for providing decoupling capacitanceIBM·Filed 2008·Granted Feb 10, 2009·9 cites·11 claims
- 3785US8881379B2Method of making heat sink for integrated circuit devicesCOOLBAUGH DOUGLAS D·Filed 2012·Granted Nov 11, 2014·4 cites·17 claims
- 3885US7855442B2Silicon based packageIBM·Filed 2007·Granted Dec 21, 2010·10 cites·7 claims
- 3985US7683478B2Hermetic seal and reliable bonding structures for 3D applicationsIBM·Filed 2008·Granted Mar 23, 2010·9 cites·3 claims
- 4084US8735251B2Through silicon via and method of fabricating sameULTRATECH INC·Filed 2013·Granted May 27, 2014·5 cites·11 claims
- 4184US8298917B2Process for wet singulation using a dicing singulation structureANDRY PAUL S·Filed 2009·Granted Oct 30, 2012·9 cites·19 claims
- 4283US8263497B2High-yield method of exposing and contacting through-silicon viasANDRY PAUL S·Filed 2009·Granted Sep 11, 2012·11 cites·18 claims
- 4383US7994895B2Heat sink for integrated circuit devicesIBM·Filed 2007·Granted Aug 9, 2011·8 cites·30 claims
- 4483US7867876B2Method of thinning a semiconductor substrateIBM·Filed 2008·Granted Jan 11, 2011·7 cites·18 claims
- 4583US7691669B2Techniques for providing decoupling capacitanceIBM·Filed 2008·Granted Apr 6, 2010·7 cites·15 claims
- 4683US7462509B2Dual-sided chip attached modulesIBM·Filed 2006·Granted Dec 9, 2008·10 cites·12 claims
- 4782US8039356B2Through silicon via lithographic alignment and registrationIBM·Filed 2010·Granted Oct 18, 2011·6 cites·10 claims
- 4882US7700410B2Chip-in-slot interconnect for 3D chip stacksIBM·Filed 2007·Granted Apr 20, 2010·9 cites·8 claims
- 4982US6661100B1Low impedance power distribution structure for a semiconductor chip packageIBM·Filed 2002·Granted Dec 9, 2003·32 cites·20 claims
- 5082US5534732ASingle twist layout and method for paired line conductors of integrated circuitsIBM·Filed 1995·Granted Jul 9, 1996·73 cites·15 claims
Showing the top 50 of 129 patent records by PatentIndex Score.
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