Inventor · disambiguated record
Hidenobu Deguchi
Also filed as: DEGUCHI HIDENOBU
4 granted patents·5 pending applications·18 citations·filing 2003–2022
70Inventor score
Top patents by PatentIndex Score
9 records- 0164US2025051573A1Curable resin composition, cured film, laminate, imaging device, semiconductor device, method for manufacturing laminate, and method for manufacturing element having contact electrodeSEKISUI CHEMICAL CO LTD·Filed 2022·Application pending·0 cites
- 0264US2025054895A1Curable resin composition, cured film, multilayered object, imaging device, semiconductor device, method for producing multilayered object, and method for producing element having junction electrodeSEKISUI CHEMICAL CO LTD·Filed 2022·Application pending·0 cites
- 0362US2011189432A1Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminateSEKISUI CHEMICAL CO LTD·Filed 2009·Application pending·0 cites
- 0458US7682691B2Resin composition of layered silicateSEKISUI CHEMICAL CO LTD·Filed 2003·Granted Mar 23, 2010·9 cites·24 claims
- 0558US2013288041A1Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer lalminateSEKISUI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 0654US7754803B2Resin compositionSEKISUI CHEMICAL CO LTD·Filed 2003·Granted Jul 13, 2010·6 cites·31 claims
- 0751US9120293B2Preliminary-cured material, roughened preliminary-cured material, and laminated bodyYOKOTA REONA·Filed 2011·Granted Sep 1, 2015·2 cites·6 claims
- 0846US2023245936A1Laminate, curable resin composition, method for manufacturing laminate, method for manufacturing substrate having junction electrode, semiconductor device, and image capturing deviceSEKISUI CHEMICAL CO LTD·Filed 2021·Application pending·0 cites
- 0939US7709085B2Thermosetting resin composition, resin sheet and resin sheet for insulated substrateSEKISUI CHEMICAL CO LTD·Filed 2004·Granted May 4, 2010·1 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →