Inventor · disambiguated record
Senhua Shi
Also filed as: SHI SENHUA
2 granted patents·0 citations·filing 2021–2022
22Inventor score
Technology areasH10P
Files withWUHAN XINXIN SEMICONDUCTOR MFG2
Top patents by PatentIndex Score
2 records- 0149US12322707B2Large die wafer, large die and method of forming the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
- 0246US12446286B2Semiconductor device and manufacturing process for the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →