Inventor · disambiguated record
Jau-Shoung Chen
Also filed as: CHEN JAU-SHOUNG
24 granted patents·8 pending applications·204 citations·filing 2002–2008
96Inventor score
Top patents by PatentIndex Score
32 records- 0181US7538421B2Flip-chip package structure with stiffenerADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted May 26, 2009·10 cites·7 claims
- 0281US6664128B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 16, 2003·25 cites·15 claims
- 0377US6861346B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 1, 2005·21 cites·20 claims
- 0475US7614888B2Flip chip package processADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 10, 2009·7 cites·12 claims
- 0575US6673711B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 6, 2004·19 cites·21 claims
- 0672US6617237B1Lead-free bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 9, 2003·19 cites·25 claims
- 0771US6827252B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Dec 7, 2004·18 cites·39 claims
- 0869US6846719B2Process for fabricating wafer bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 25, 2005·16 cites·18 claims
- 0961US6989326B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 24, 2006·10 cites·24 claims
- 1060US6732912B2Solder ball attaching processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 11, 2004·8 cites·29 claims
- 1156US6723630B2Solder ball fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 20, 2004·7 cites·19 claims
- 1256US6720244B2Bump fabrication methodADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 13, 2004·7 cites·18 claims
- 1355US7064428B2Wafer-level package structureADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 20, 2006·6 cites·6 claims
- 1453US6939790B2Wafer bumping process with solder balls bonded to under bump metallurgy layer formed over active surface by forming flux on solder ball surfaces and reflowing the solderADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 6, 2005·5 cites·13 claims
- 1553US6927964B2Structure for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 9, 2005·4 cites·9 claims
- 1653US6908842B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 21, 2005·5 cites·13 claims
- 1750US6875683B2Method of forming bumpADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 5, 2005·4 cites·29 claims
- 1850US6716739B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 6, 2004·4 cites·112 claims
- 1948US6967153B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 22, 2005·2 cites·27 claims
- 2048US6743707B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 1, 2004·3 cites·10 claims
- 2147US6756256B2Method for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 29, 2004·2 cites·8 claims
- 2246US6877653B2Method of modifying tin to lead ratio in tin-lead bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 12, 2005·1 cites·15 claims
- 2345US6713320B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Mar 30, 2004·1 cites·20 claims
- 2443US2008009104A1Semiconductor package having electromagnetic interference shielding and fabricating method thereofCHEN JAU-SHOUNG·Filed 2006·Application pending·0 cites
- 2541US2006063305A1Process of fabricating flip-chip packagesWEI TZU-CHUNG·Filed 2005·Application pending·0 cites
- 2639US2003161123A1Bonding structure for bonding substrates by metal studsFiled 2003·Application pending·0 cites
- 2738US2003146191A1Etching method for nickel-vanadium alloyFiled 2003·Application pending·0 cites
- 2837US2003157791A1Process of fabricating bumpsFiled 2003·Application pending·0 cites
- 2937US2003157438A1Bump forming processFiled 2003·Application pending·0 cites
- 3037US2003160335A1Flip chip interconnection structure and fabrication process thereofFiled 2003·Application pending·0 cites
- 3136US8059422B2Thermally enhanced package structureTONG HO-MING·Filed 2008·Granted Nov 15, 2011·0 cites·14 claims
- 3236US2003164552A1Under-ball metallic layerFiled 2002·Application pending·0 cites
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