Inventor · disambiguated record

Taegki Lim

Also filed as: LIM TAEGKI

1 granted patent·10 citations·filing 2009–2009

32Inventor score

Technology areasH10W

Files withLIM TAEGKI1

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1 record

0171US9136144B2Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulationLIM TAEGKI·Filed 2009·Granted Sep 15, 2015·10 cites·25 claims

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Taegki Lim — Patent Inventor | PatentIndex