Inventor · disambiguated record

Jung Sell

Also filed as: SELL JUNG

1 granted patent·1 citations·filing 2011–2011

16Inventor score

Technology areasH10W

Files withCHOI DAESIK1

Top patents by PatentIndex Score

1 record

0155US8748233B2Integrated circuit packaging system with underfill and method of manufacture thereofCHOI DAESIK·Filed 2011·Granted Jun 10, 2014·1 cites·5 claims

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