Inventor · disambiguated record
Tetsu Osawa
Also filed as: OSAWA TETSU
13 granted patents·1 pending application·428 citations·filing 1992–2007
94Inventor score
Files withTOKYO ELECTRON LTD13
Top patents by PatentIndex Score
14 records- 0188US5820367ABoat for heat treatmentTOKYO ELECTRON LTD·Filed 1996·Granted Oct 13, 1998·64 cites·4 claims
- 0287US7629033B2Plasma processing method for forming a silicon nitride film on a silicon oxide filmTOKYO ELECTRON LTD·Filed 2007·Granted Dec 8, 2009·11 cites·3 claims
- 0386US6372084B2Plasma processing apparatus with a dielectric plate having a thickness based on a wavelength of a microwave introduced into a process chamber through the dielectric plateTOKYO ELECTRON LTD·Filed 2001·Granted Apr 16, 2002·42 cites·10 claims
- 0483US6080965ASingle-substrate-heat-treatment apparatus in semiconductor processing systemTOKYO ELECTRON LTD·Filed 1998·Granted Jun 27, 2000·74 cites·17 claims
- 0580US6656322B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2001·Granted Dec 2, 2003·17 cites·15 claims
- 0678US6797111B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2001·Granted Sep 28, 2004·17 cites·9 claims
- 0777US6510365B1Carrier system positioning methodTOKYO ELECTRON LTD·Filed 1999·Granted Jan 21, 2003·57 cites·20 claims
- 0870US6675737B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2001·Granted Jan 13, 2004·10 cites·9 claims
- 0969US6259061B1Vertical-heat-treatment apparatus with movable lid and compensation heater movable therewithTOKYO ELECTRON LTD·Filed 1998·Granted Jul 10, 2001·37 cites·17 claims
- 1063US5357115AProcessing method for wafersTOKYO ELECTRON LTD·Filed 1993·Granted Oct 18, 1994·35 cites·13 claims
- 1163US5248886AProcessing systemTOKYO ELECTRON LTD·Filed 1992·Granted Sep 28, 1993·36 cites·20 claims
- 1258US6123429ALight source deviceTOKYO ELECTRON LTD·Filed 1998·Granted Sep 26, 2000·23 cites·5 claims
- 1354US7393172B1Untreated body transfer device and semiconductor manufacturing device with the untreated body transfer deviceTOKYO ELECTRON LTD·Filed 2000·Granted Jul 1, 2008·5 cites·6 claims
- 1437US2002002948A1Plasma processing apparatus having an evacuating arrangement to evacuate gas from a gas-introducing part of a process chamberFiled 2001·Application pending·0 cites
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