Inventor · disambiguated record
Anthony B. Suppelsa
Also filed as: SUPPELSA ANTHONY B · SUPPELSA SR ANTHONY B
40 granted patents·3,289 citations·filing 1979–1997
99Inventor score
Files withMOTOROLA INC40
Top patents by PatentIndex Score
40 records- 0199US5371404AThermally conductive integrated circuit package with radio frequency shieldingMOTOROLA INC·Filed 1993·Granted Dec 6, 1994·462 cites·16 claims
- 0298US5264061AMethod of forming a three-dimensional printed circuit assemblyMOTOROLA INC·Filed 1992·Granted Nov 23, 1993·339 cites·14 claims
- 0397US5421083AMethod of manufacturing a circuit carrying substrate having coaxial via holesMOTOROLA INC·Filed 1994·Granted Jun 6, 1995·178 cites·10 claims
- 0497US5024372AMethod of making high density solder bumps and a substrate socket for high density solder bumpsMOTOROLA INC·Filed 1990·Granted Jun 18, 1991·221 cites·6 claims
- 0597US4940181APad grid array for receiving a solder bumped chip carrierMOTOROLA INC·Filed 1989·Granted Jul 10, 1990·193 cites·19 claims
- 0697US4894663AUltra thin radio housing with integral antennaMOTOROLA INC·Filed 1987·Granted Jan 16, 1990·305 cites·13 claims
- 0796US4939792AMoldable/foldable radio housingMOTOROLA INC·Filed 1987·Granted Jul 3, 1990·120 cites·13 claims
- 0894US5438216ALight erasable multichip moduleMOTOROLA INC·Filed 1992·Granted Aug 1, 1995·181 cites·23 claims
- 0991US5218759AMethod of making a transfer molded semiconductor deviceMOTOROLA INC·Filed 1991·Granted Jun 15, 1993·140 cites·19 claims
- 1089US5379186AEncapsulated electronic component having a heat diffusing layerMOTOROLA INC·Filed 1993·Granted Jan 3, 1995·116 cites·8 claims
- 1189US5255839AMethod for solder application and reflowMOTOROLA INC·Filed 1992·Granted Oct 26, 1993·122 cites·7 claims
- 1288US5280139ASelectively releasing conductive runner and substrate assemblyMOTOROLA INC·Filed 1992·Granted Jan 18, 1994·101 cites·10 claims
- 1385US5177134ATacking agentMOTOROLA INC·Filed 1990·Granted Jan 5, 1993·47 cites·13 claims
- 1485US5166774ASelectively releasing conductive runner and substrate assembly having non-planar areasMOTOROLA INC·Filed 1990·Granted Nov 24, 1992·84 cites·8 claims
- 1583US5536917AHousing with integral thin film resistive snap-fitsMOTOROLA INC·Filed 1994·Granted Jul 16, 1996·43 cites·1 claims
- 1682US5232758ANon-hardening solvent removable hydrophobic conformal coatingsMOTOROLA INC·Filed 1990·Granted Aug 3, 1993·44 cites·16 claims
- 1780US5573859AAuto-regulating solder compositionMOTOROLA INC·Filed 1995·Granted Nov 12, 1996·45 cites·15 claims
- 1877US5542171AMethod of selectively releasing plastic molding material from a surfaceMOTOROLA INC·Filed 1991·Granted Aug 6, 1996·56 cites·7 claims
- 1976US5065122ATransmission line using fluroplastic as a dielectricMOTOROLA INC·Filed 1990·Granted Nov 12, 1991·41 cites·13 claims
- 2074US5637834AMultilayer circuit substrate and method for forming sameMOTOROLA INC·Filed 1995·Granted Jun 10, 1997·50 cites·28 claims
- 2174US4338506AMethod of trimming thick film capacitorMOTOROLA INC·Filed 1979·Granted Jul 6, 1982·23 cites·5 claims
- 2273US5177669AMolded ring integrated circuit packageMOTOROLA INC·Filed 1992·Granted Jan 5, 1993·57 cites·18 claims
- 2373US5172852ASoldering methodMOTOROLA INC·Filed 1992·Granted Dec 22, 1992·36 cites·16 claims
- 2473US5001038AProcess for photoimaging a three dimensional printed circuit substrateMOTOROLA INC·Filed 1987·Granted Mar 19, 1991·23 cites·3 claims
- 2572US5771004AGas detection system for a portable communicationMOTOROLA INC·Filed 1997·Granted Jun 23, 1998·40 cites·9 claims
- 2666US5686226AMethod of forming an applicator for applying tacking media to a circuit substrateMOTOROLA INC·Filed 1995·Granted Nov 11, 1997·21 cites·9 claims
- 2764US5167361AMethod and apparatus for two sided solder cladded surface mounted printed circuit boardsMOTOROLA INC·Filed 1991·Granted Dec 1, 1992·30 cites·23 claims
- 2862US4990724AMethod and apparatus for electrically interconnecting opposite sides of a flex circuitMOTOROLA INC·Filed 1989·Granted Feb 5, 1991·21 cites·8 claims
- 2961US5300808AEPROM package and method of optically erasingMOTOROLA INC·Filed 1992·Granted Apr 5, 1994·32 cites·15 claims
- 3059US5591364AHousing with integral opening featureMOTOROLA INC·Filed 1995·Granted Jan 7, 1997·17 cites·8 claims
- 3157US5455446ALeaded semiconductor package having temperature controlled lead lengthMOTOROLA INC·Filed 1994·Granted Oct 3, 1995·24 cites·14 claims
- 3256US5773198AMethod of forming high resolution circuitry by depositing a polyvinyl alcohol layer beneath a photosensitive polymer layerMOTOROLA INC·Filed 1996·Granted Jun 30, 1998·18 cites·12 claims
- 3354US5116433ASolder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing sameMOTOROLA INC·Filed 1990·Granted May 26, 1992·14 cites·21 claims
- 3451US5740066AElectrical circuit board and circuit board assemblyMOTOROLA INC·Filed 1995·Granted Apr 14, 1998·14 cites·8 claims
- 3544US5373276ASelf centering coilMOTOROLA INC·Filed 1993·Granted Dec 13, 1994·8 cites·6 claims
- 3638US5075820ACircuit components having different characteristics with constant sizeMOTOROLA INC·Filed 1990·Granted Dec 24, 1991·5 cites·26 claims
- 3737US5338391AMethod of making a substrate having selectively releasing conductive runnersMOTOROLA INC·Filed 1993·Granted Aug 16, 1994·8 cites·21 claims
- 3836US5028399AGas manifold for solder reflow processing atmosphereMOTOROLA INC·Filed 1990·Granted Jul 2, 1991·5 cites·5 claims
- 3933US4992139AConductive mask and method of making sameMOTOROLA INC·Filed 1989·Granted Feb 12, 1991·3 cites·9 claims
- 4031US5176773AMethod of manufacturing a ceramic carrierMOTOROLA INC·Filed 1990·Granted Jan 5, 1993·2 cites·3 claims
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