Inventor · disambiguated record
Masaki Murobayashi
Also filed as: MUROBAYASHI MASAKI
9 granted patents·8 pending applications·14 citations·filing 2001–2025
81Inventor score
Top patents by PatentIndex Score
17 records- 0194US11905596B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·2 cites·12 claims
- 0282US12249485B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Mar 11, 2025·0 cites·16 claims
- 0382US12195854B2Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Jan 14, 2025·0 cites·20 claims
- 0481US11837440B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 5, 2023·1 cites·12 claims
- 0578US11145491B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Oct 12, 2021·1 cites·16 claims
- 0675US2025201518A1Plasma unit, substrate processing apparatus, method of processing, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0768US11384431B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Granted Jul 12, 2022·1 cites·18 claims
- 0868US2023230818A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0968US2023212753A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1067US2025191878A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1165US12230474B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 18, 2025·0 cites·19 claims
- 1262US6658321B2Substrate processing method and apparatusHITACHI INT ELECTRIC INC·Filed 2001·Granted Dec 2, 2003·9 cites·8 claims
- 1360US11155922B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 26, 2021·0 cites·6 claims
- 1452US2022415700A1Substrate processing apparatus, substrate mounting table cover, method of manufacturing semiconductor device and non-transitory computer readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1541US2012067274A1Film forming apparatus, wafer holder, and film forming methodHARA DAISUKE·Filed 2011·Application pending·0 cites
- 1637US2011204036A1Heat treatment apparatusHITACHI INT ELECTRIC INC·Filed 2011·Application pending·0 cites
- 1737US2012214317A1Substrate processing apparatus and method, and semiconductor device manufacturing methodMUROBAYASHI MASAKI·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →