Inventor · disambiguated record
Ryoichi Uchimura
Also filed as: UCHIMURA RYOICHI
3 granted patents·1 pending application·0 citations·filing 2017–2024
42Inventor score
Top patents by PatentIndex Score
4 records- 0166US2024173927A1Laminate, printed wiring board, semiconductor package, and method for manufacturing laminateRESONAC CORP·Filed 2024·Application pending·0 cites
- 0254US11938688B2Laminate, printed wiring board, semiconductor package, and method for manufacturing laminateSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 26, 2024·0 cites·10 claims
- 0350US11497117B2Metal-clad laminate, printed wiring board and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2017·Granted Nov 8, 2022·0 cites·21 claims
- 0436US11040517B2Printed wiring board and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2017·Granted Jun 22, 2021·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →