Inventor · disambiguated record

Kwangseok Oh

Also filed as: OH KWANGSEOK

1 granted patent·19 citations·filing 2008–2008

39Inventor score

Technology areasH10W

Files withST AMAND ROGER D1

Top patents by PatentIndex Score

1 record

0184US8836115B1Stacked inverted flip chip package and fabrication methodST AMAND ROGER D·Filed 2008·Granted Sep 16, 2014·19 cites·13 claims

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