Inventor · disambiguated record
Yuanlin Xie
Also filed as: XIE YUANLIN · XIE YUANLIN JOHN
24 granted patents·1 pending application·176 citations·filing 2005–2016
95Inventor score
Top patents by PatentIndex Score
25 records- 0196US9418965B1Embedded interposer with through-hole viasALTERA CORP·Filed 2014·Granted Aug 16, 2016·33 cites·20 claims
- 0294US9196575B1Integrated circuit package with cavity in substrateALTERA CORP·Filed 2013·Granted Nov 24, 2015·27 cites·17 claims
- 0389US9673173B1Integrated circuit package with embedded passive structuresALTERA CORP·Filed 2015·Granted Jun 6, 2017·7 cites·20 claims
- 0489US7405473B1Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routingALTERA CORP·Filed 2005·Granted Jul 29, 2008·18 cites·24 claims
- 0588US7501709B1BGA package with wiring schemes having reduced current loop paths to improve cross talk control and characteristic impedanceALTERA CORP·Filed 2006·Granted Mar 10, 2009·19 cites·21 claims
- 0686US7472367B1Method of optimizing interconnect distribution to improve signal integrityALTERA CORP·Filed 2005·Granted Dec 30, 2008·18 cites·14 claims
- 0783US7262079B2Consolidated flip chip BGA assembly process and apparatusALTERA CORP·Filed 2005·Granted Aug 28, 2007·12 cites·22 claims
- 0880US9559036B1Integrated circuit package with plated heat spreaderALTERA CORP·Filed 2014·Granted Jan 31, 2017·5 cites·11 claims
- 0978US9842813B2Tranmission line bridge interconnectsALTERA CORP·Filed 2015·Granted Dec 12, 2017·3 cites·22 claims
- 1078US7883937B1Electronic package and method of forming the sameALTERA CORP·Filed 2007·Granted Feb 8, 2011·7 cites·11 claims
- 1178US7309912B1On-package edge-mount power decoupling and implementation with novel substrate design for FPGA and ASIC devicesALTERA CORP·Filed 2006·Granted Dec 18, 2007·8 cites·16 claims
- 1277US8498129B1Power distribution networkLIU HUI·Filed 2011·Granted Jul 30, 2013·4 cites·20 claims
- 1374US9401287B2Methods for packaging integrated circuitsALTERA CORP·Filed 2014·Granted Jul 26, 2016·3 cites·16 claims
- 1469US8198699B1Integrated circuit package with non-solder mask defined like padsXIE YUANLIN·Filed 2010·Granted Jun 12, 2012·4 cites·17 claims
- 1568US9462691B1Enhanced ball grid arrayALTERA CORP·Filed 2014·Granted Oct 4, 2016·2 cites·25 claims
- 1665US9401330B1IC package with non-uniform dielectric layer thicknessJIANG XIAOHONG·Filed 2009·Granted Jul 26, 2016·3 cites·10 claims
- 1761US8710643B2Electronic package with fluid flow barriersKANG TECK-GYU·Filed 2011·Granted Apr 29, 2014·1 cites·16 claims
- 1861US7936059B1Lead frame packaging technique with reduced noise and cross-talkALTERA CORP·Filed 2007·Granted May 3, 2011·2 cites·18 claims
- 1950US9536820B1Power distribution networkALTERA CORP·Filed 2013·Granted Jan 3, 2017·0 cites·19 claims
- 2049US9748197B2Methods for packaging integrated circuitsALTERA CORP·Filed 2016·Granted Aug 29, 2017·0 cites·10 claims
- 2145US9570342B1Via structure and method for its fabricationALTERA CORP·Filed 2014·Granted Feb 14, 2017·0 cites·20 claims
- 2244US9698123B2Apparatus for stacked electronic circuitry and associated methodsRAHMAN ARIFUR·Filed 2011·Granted Jul 4, 2017·0 cites·14 claims
- 2343US8242608B2Universal bump array structureCHANG LI-TIEN·Filed 2008·Granted Aug 14, 2012·0 cites·20 claims
- 2442US2014264783A1Apparatus for electronic assembly with improved interconnect and associated methodsALTERA CORP·Filed 2013·Application pending·0 cites
- 2540US9893034B2Integrated circuit packages with detachable interconnect structuresALTERA CORP·Filed 2015·Granted Feb 13, 2018·0 cites·15 claims
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