Inventor · disambiguated record
Ti-Bin Chen
Also filed as: CHEN TI-BIN
16 granted patents·9 pending applications·24 citations·filing 2012–2025
88Inventor score
Top patents by PatentIndex Score
25 records- 0190US8524556B1Resistor and manufacturing method thereofCHIOU CHUN-MAO·Filed 2012·Granted Sep 3, 2013·21 cites·12 claims
- 0288US2025015158A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0384US12237394B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Feb 25, 2025·0 cites·7 claims
- 0484US12125890B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 22, 2024·0 cites·6 claims
- 0579US11757016B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 12, 2023·0 cites·13 claims
- 0678US2025159964A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0774US2024332086A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0874US2024332087A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0973US11664425B2P-type field effect transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted May 30, 2023·0 cites·6 claims
- 1073US11322598B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 3, 2022·0 cites·7 claims
- 1173US8692334B2Resistor integrated with transistor having metal gateUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 8, 2014·3 cites·6 claims
- 1271US11705492B2Method for fabricating semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jul 18, 2023·0 cites·10 claims
- 1368US12040234B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jul 16, 2024·0 cites·8 claims
- 1468US11916126B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Feb 27, 2024·0 cites·17 claims
- 1566US11271078B2P-type field effect transistor having channel region with top portion and bottom portionUNITED MICROELECTRONICS CORP·Filed 2020·Granted Mar 8, 2022·0 cites·1 claims
- 1665US11538917B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 27, 2022·0 cites·17 claims
- 1765US10734496B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 4, 2020·0 cites·8 claims
- 1864US11031477B2Method for fabricating semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 8, 2021·0 cites·12 claims
- 1958US2025212426A1Metal-insulator-metal capacitor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2057US10651275B2P-type field effect transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 12, 2020·0 cites·6 claims
- 2157US10541309B2Semiconductor structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 21, 2020·0 cites·7 claims
- 2257US2025240985A1Semiconductor structure with a deep trench capacitor structures and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2354US2024274715A1Semiconductor device having anisotropic layerUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2453US2025089334A1semiconductor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2538US2020006517A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →