Inventor · disambiguated record
Frank Daeche
Also filed as: DAECHE FRANK
23 granted patents·3 pending applications·247 citations·filing 2002–2023
93Inventor score
Files withINFINEON TECHNOLOGIES AG13INFINEON TECHNOLOGIES AUSTRIA AG5INFINEON TECHNOLOGIES DRESDEN GMBH2MEYER-BERG GEORG2DAECHE FRANK1
Top patents by PatentIndex Score
26 records- 0194US7268436B2Electronic device with cavity and a method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 11, 2007·125 cites·6 claims
- 0291US7221048B2Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrierINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 22, 2007·26 cites·16 claims
- 0389US7031170B2Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic deviceINFINEON TECHNOLOGIES AG·Filed 2002·Granted Apr 18, 2006·66 cites·64 claims
- 0481US9773719B2Semiconductor packages and methods of fabrication thereofINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2012·Granted Sep 26, 2017·5 cites·24 claims
- 0579US11996771B2Power semiconductor system having an inductor module attached to a power stage moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted May 28, 2024·0 cites·14 claims
- 0676US10186481B2Semiconductor device including a passive component formed in a redistribution layerINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jan 22, 2019·1 cites·21 claims
- 0772US11539291B2Method of manufacturing a power semiconductor systemINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Dec 27, 2022·0 cites·6 claims
- 0870US10833583B2Methods of manufacturing inductor modules and power semiconductor systems having inductor modulesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Nov 10, 2020·0 cites·18 claims
- 0970US10325834B2Semiconductor packages and methods of fabrication thereofINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2017·Granted Jun 18, 2019·1 cites·22 claims
- 1069US9059155B2Chip package and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 16, 2015·2 cites·24 claims
- 1169US8686569B2Die arrangement and method of forming a die arrangementDAECHE FRANK·Filed 2010·Granted Apr 1, 2014·4 cites·15 claims
- 1269US7011986B2Method for manufacturing a housing for a chip with a micromechanical structureINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 14, 2006·15 cites·20 claims
- 1368US11903132B2Power electronic assembly having a laminate inlay and method of producing the power electronic assemblyINFINEON TECHNOLOGIES AG·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 1468US2023282553A1Power electronic assembly and power module for embedding in a printed circuit boardINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1567US11699640B2Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of productionINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jul 11, 2023·0 cites·17 claims
- 1664US9437548B2Chip package and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Sep 6, 2016·1 cites·20 claims
- 1762US9425116B2Integrated circuit package and a method for manufacturing an integrated circuit packageINFINEON TECHNOLOGIES AG·Filed 2012·Granted Aug 23, 2016·1 cites·14 claims
- 1858US10601314B2Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modulesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Mar 24, 2020·0 cites·13 claims
- 1955US11632860B2Power electronic assembly and method of producing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 18, 2023·0 cites·20 claims
- 2052US11004823B2Chip assembly and method of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 11, 2021·0 cites·18 claims
- 2150US11562967B2Method for fabricating a semiconductor package, semiconductor package and embedded PCB moduleINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 24, 2023·0 cites·20 claims
- 2250US11183445B2Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 23, 2021·0 cites·20 claims
- 2343US9105562B2Integrated circuit package and packaging methodsMEYER-BERG GEORG·Filed 2011·Granted Aug 11, 2015·0 cites·11 claims
- 2441US9269685B2Integrated circuit package and packaging methodsMEYER-BERG GEORG·Filed 2011·Granted Feb 23, 2016·0 cites·24 claims
- 2536US2012299150A1Power Semiconductor Module with Embedded Chip PackageTANG BENJAMIN·Filed 2011·Application pending·0 cites
- 2632US2003047760A1Electronic component with at least two semiconductor chips, and process for its productionFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →