Inventor · disambiguated record

Naoki Nara

Also filed as: NARA NAOKI

3 granted patents·58 citations·filing 1998–2004

72Inventor score

Technology areasH10W

Files withHITACHI CHEMICAL CO LTD3

Top patents by PatentIndex Score

3 records

0177US7397139B2Epoxy resin molding material for sealing use and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 8, 2008·33 cites·25 claims
0244US6005030AEpoxy resin composition for semiconductor sealing and resin molded type semiconductor device sealed with the epoxy resin compositionHITACHI CHEMICAL CO LTD·Filed 1998·Granted Dec 21, 1999·18 cites·12 claims
0333US6211277B1Encapsulating material and LOC structure semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Apr 3, 2001·7 cites·13 claims

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