Inventor · disambiguated record

Pakman Wong

Also filed as: WONG PAKMAN

2 granted patents·11 citations·filing 2006–2006

55Inventor score

Technology areasG06F H10W

Files withTELA INNOVATIONS INC2

Top patents by PatentIndex Score

2 records

0168US7745239B1Arrangement of fill unit elements in an integrated circuit interconnect layerTELA INNOVATIONS INC·Filed 2006·Granted Jun 29, 2010·5 cites·6 claims
0267US7676772B1Layout description having enhanced fill annotationTELA INNOVATIONS INC·Filed 2006·Granted Mar 9, 2010·6 cites·13 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →