Inventor · disambiguated record
O. Samuel Nakagawa
Also filed as: NAKAGAWA O S · NAKAGAWA O SAMUEL
2 granted patents·2 pending applications·11 citations·filing 2005–2008
55Inventor score
Top patents by PatentIndex Score
4 records- 0168US7745239B1Arrangement of fill unit elements in an integrated circuit interconnect layerTELA INNOVATIONS INC·Filed 2006·Granted Jun 29, 2010·5 cites·6 claims
- 0267US7676772B1Layout description having enhanced fill annotationTELA INNOVATIONS INC·Filed 2006·Granted Mar 9, 2010·6 cites·13 claims
- 0342US2010107133A1Method for increasing cell uniformity in an integrated circuit by adjusting cell inputs to design processNAKAGAWA O SAMUEL·Filed 2008·Application pending·0 cites
- 0437US2007033558A1Method and system for reshaping metal wires in VLSI designBLAZE DFM INC·Filed 2005·Application pending·0 cites
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