Inventor · disambiguated record
Keizo Hirai
Also filed as: HIRAI KEIZO
5 granted patents·4 pending applications·145 citations·filing 1996–2006
84Inventor score
Files withHITACHI CHEMICAL CO LTD9
Top patents by PatentIndex Score
9 records- 0186US6783434B1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 1999·Granted Aug 31, 2004·61 cites·23 claims
- 0270US7163644B2CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jan 16, 2007·8 cites·9 claims
- 0370US5840432AElectroconductive pasteHITACHI CHEMICAL CO LTD·Filed 1996·Granted Nov 24, 1998·36 cites·37 claims
- 0463US6372859B1Thermoresistance adhesive and semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Apr 16, 2002·29 cites·5 claims
- 0552US2006197054A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 0652US2006186372A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 0750US2005269295A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 0845US6042933AElectric circuit device having circuit conductors using an electroconductive pasteHITACHI CHEMICAL CO LTD·Filed 1998·Granted Mar 28, 2000·11 cites·16 claims
- 0943US2004147206A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →