Inventor · disambiguated record
Bradford J. Factor
Also filed as: FACTOR BRADFORD J · FACTOR Bradford
4 granted patents·2 pending applications·26 citations·filing 1987–2020
72Inventor score
Top patents by PatentIndex Score
6 records- 0177US11437247B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 6, 2022·1 cites·18 claims
- 0276US10177099B2Semiconductor package structure, package on package structure and packaging methodADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 8, 2019·4 cites·21 claims
- 0353US4800397AMetal transfer to form printing master plate or printed circuit boardIBM·Filed 1987·Granted Jan 24, 1989·16 cites·21 claims
- 0445US4836105ADirect negative and offset master production using thermal liftoffIBM·Filed 1987·Granted Jun 6, 1989·5 cites·13 claims
- 0544US2010052156A1Chip scale package structure and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 0644US2010052186A1Stacked type chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
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