Inventor · disambiguated record
Jean-Marc Yannou
Also filed as: YANNOU JEAN MARC
7 granted patents·2 pending applications·25 citations·filing 2004–2023
80Inventor score
Top patents by PatentIndex Score
9 records- 0177US11437247B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 6, 2022·1 cites·18 claims
- 0268US8541865B2Semiconductor device with improved ESD protectionYANNOU JEAN-MARC·Filed 2008·Granted Sep 24, 2013·8 cites·13 claims
- 0363US8178901B2Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chipGAMAND PATRICE·Filed 2006·Granted May 15, 2012·6 cites·14 claims
- 0456US2024355793A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 0555US7899641B2Testable electronic circuitNXP BV·Filed 2006·Granted Mar 1, 2011·3 cites·7 claims
- 0653US8963314B2Packaged semiconductor product and method for manufacture thereofPIERAERTS ERIC·Filed 2009·Granted Feb 24, 2015·4 cites·17 claims
- 0744US2010044853A1System-in-package with through substrate via holesNXP BV·Filed 2008·Application pending·0 cites
- 0835US7519496B2Electronic circuit comprising a secret sub-moduleNXP BV·Filed 2004·Granted Apr 14, 2009·2 cites·8 claims
- 0929US7519494B2Integrated circuit with signature computationNXP BV·Filed 2004·Granted Apr 14, 2009·1 cites·6 claims
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