Inventor · disambiguated record
Juha Paavola
Also filed as: PAAVOLA JUHA · PAAVOLA JUHA T · PAAVOLA JUHA TAPANI
27 granted patents·23 pending applications·91 citations·filing 1992–2025
94Inventor score
Top patents by PatentIndex Score
50 records- 0194US11930620B2Vapor chambersINTEL CORP·Filed 2020·Granted Mar 12, 2024·7 cites·11 claims
- 0293US12284793B2Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devicesINTEL CORP·Filed 2020·Granted Apr 22, 2025·6 cites·21 claims
- 0392US12085995B2Dynamic curvature devices and peripheralsINTEL CORP·Filed 2020·Granted Sep 10, 2024·3 cites·25 claims
- 0490US11277929B2Personal computing device covers having standsINTEL CORP·Filed 2019·Granted Mar 15, 2022·5 cites·27 claims
- 0587US10932393B2Torsional heat pipeINTEL CORP·Filed 2019·Granted Feb 23, 2021·6 cites·20 claims
- 0686USD1001797SComputerINTEL CORP·Filed 2020·Granted Oct 17, 2023·2 cites·1 claims
- 0782US11870088B2Structural battery with pressure housing for portable electronic devicesINTEL CORP·Filed 2020·Granted Jan 9, 2024·1 cites·20 claims
- 0880US9618973B2Mechanically embedded heating elementINTEL CORP·Filed 2015·Granted Apr 11, 2017·7 cites·23 claims
- 0977US10921869B2Chassis embedded heat pipeINTEL CORP·Filed 2019·Granted Feb 16, 2021·2 cites·16 claims
- 1076US11963335B2Heatsink with a sandwich plate constructionINTEL CORP·Filed 2020·Granted Apr 16, 2024·1 cites·14 claims
- 1176US5306324AMethod and apparatus for bending and tempering a glass sheetTAMGLASS ENG OY·Filed 1992·Granted Apr 26, 1994·26 cites·14 claims
- 1275US2025142778A1Heat pipe for improved thermal performance at cold plate interfaceINTEL CORP·Filed 2024·Application pending·0 cites
- 1374US12482891B2Methods and apparatus to increase stacking pressure in battery cellsINTEL CORP·Filed 2022·Granted Nov 25, 2025·0 cites·24 claims
- 1473US11930610B2Personal computing device covers having standsINTEL CORP·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
- 1569US11573055B2Vapor chamber and means of attachmentINTEL CORP·Filed 2019·Granted Feb 7, 2023·1 cites·16 claims
- 1667US12477691B2Cooling systems with heat pipes for electronic devicesINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1767US5501717AMethod and furnace apparatus for bending and tempering a glass sheet supported on a ring mouldTAMGLASS ENG OY·Filed 1994·Granted Mar 26, 1996·19 cites·16 claims
- 1867US2025254848A1Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling sys-tems, cooling structures and electronic devicesINTEL CORP·Filed 2025·Application pending·0 cites
- 1966US12396125B2Removable fan cartridges for electronic devicesINTEL CORP·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 2065US12082378B2Thermally conductive shock absorbers for electronic devicesINTEL CORP·Filed 2020·Granted Sep 3, 2024·0 cites·20 claims
- 2163US12262508B2Heat pipe for improved thermal performance at cold plate interfaceINTEL CORP·Filed 2020·Granted Mar 25, 2025·0 cites·17 claims
- 2261US11903161B2Fan supportINTEL CORP·Filed 2020·Granted Feb 13, 2024·0 cites·20 claims
- 2361US6786065B2Method and apparatus for bending glassUNIGLASS ENGINEERING OY·Filed 2002·Granted Sep 7, 2004·3 cites·21 claims
- 2459US12439572B2Thermal solution as an effective EMI shieldINTEL CORP·Filed 2021·Granted Oct 7, 2025·0 cites·11 claims
- 2559US12303957B2Extruded heat pipeINTEL CORP·Filed 2020·Granted May 20, 2025·0 cites·14 claims
- 2658US11576282B2Cold plate attachment with stabilizing armINTEL CORP·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 2758US7059155B2Method of bending glassUNIGLASS ENGINEERING OY·Filed 2002·Granted Jun 13, 2006·2 cites·7 claims
- 2858US2024210988A1Composite Materials for Electronic Device Chassis and Related MethodsINTEL CORP·Filed 2023·Application pending·0 cites
- 2958US2021043964A1Uniform pressure battery packaging apparatusINTEL CORP·Filed 2020·Application pending·0 cites
- 3057US2025096154A1Package Substrates with Stiffener InterposersINTEL CORP·Filed 2023·Application pending·0 cites
- 3156US2024324108A1Architectures and methods that enable a reworkable heat management componentINTEL CORP·Filed 2023·Application pending·0 cites
- 3254US12082332B2Thermal management systems having signal transfer routing for use with electronic devicesINTEL CORP·Filed 2020·Granted Sep 3, 2024·0 cites·20 claims
- 3353US2023097977A1Vacuum-based attachment for heat sink and radiation shieldINTEL CORP·Filed 2022·Application pending·0 cites
- 3452US2023016486A1Low-cost surface mount emi gasketsINTEL CORP·Filed 2022·Application pending·0 cites
- 3551US2025008697A1Die contact torsional springsINTEL CORP·Filed 2023·Application pending·0 cites
- 3649US2025003695A1Variable heat pipe thickness and diameter for direct heat pipe attachment and improved thermal managementINTEL CORP·Filed 2023·Application pending·0 cites
- 3749US2025008711A1Method and apparatus for stiffening an electronic deviceINTEL CORP·Filed 2023·Application pending·0 cites
- 3848US2023108868A1Methods and apparatus to increase rigidity of printed circuit boardsINTEL CORP·Filed 2022·Application pending·0 cites
- 3948US2025004505A1Keyboard switch design for ultrathin computing devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 4048US2024292539A1Circuit board interconnect interposer and methodINTEL CORP·Filed 2023·Application pending·0 cites
- 4147US2024389289A1Apparatus and system of electromagnetic interference (emi) shieldingINTEL CORP·Filed 2023·Application pending·0 cites
- 4246US2020029449A1Flexible chassis for a flexible displayINTEL CORP·Filed 2019·Application pending·0 cites
- 4346US2022418083A1Top side frame stiffener structure for a printed circuit board (pcb) stackINTEL CORP·Filed 2022·Application pending·0 cites
- 4444US2022336322A1Technologies for package loading mechanismsINTEL CORP·Filed 2022·Application pending·0 cites
- 4544US2022338340A1Hook and loop attachment for radiation shield and heat sinkINTEL CORP·Filed 2022·Application pending·0 cites
- 4644US2023022182A1Thermal management systems having prestressed biasing elements and related methodsTHE INTEL CORP·Filed 2022·Application pending·0 cites
- 4743US2022217848A1Printed circuit board with an edge stiffener structureINTEL CORP·Filed 2022·Application pending·0 cites
- 4840US2021034115A1Serviceable displays with narrow bezelsINTEL CORP·Filed 2020·Application pending·0 cites
- 4938US2021112673A1Concept for a Kickstand of a Computing DeviceHUTTULA JUSTIN·Filed 2020·Application pending·0 cites
- 5028USD1054410SModular electronic deviceINTEL CORP·Filed 2020·Granted Dec 17, 2024·0 cites·1 claims
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