Inventor · disambiguated record
Linlin Chen
Also filed as: CHEN LINLIN
39 granted patents·22 pending applications·2,576 citations·filing 1998–2025
98Inventor score
Files withSEMITOOL INC41TEXAS INSTRUMENTS INC7CSPC ZHONGQI PHARMACEUTICAL TECH SHIJIAZHUANG CO LTD2LEMON INC2BEIJING ZITIAO NETWORK TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
61 records- 0199US6565729B2Method for electrochemically depositing metal on a semiconductor workpieceSEMITOOL INC·Filed 2000·Granted May 20, 2003·435 cites·59 claims
- 0298US6932892B2Apparatus and method for electrolytically depositing copper on a semiconductor workpieceSEMITOOL INC·Filed 2003·Granted Aug 23, 2005·226 cites·5 claims
- 0398US6197181B1Apparatus and method for electrolytically depositing a metal on a microelectronic workpieceSEMITOOL INC·Filed 1998·Granted Mar 6, 2001·649 cites·64 claims
- 0497US6638410B2Apparatus and method for electrolytically depositing copper on a semiconductor workpieceSEMITOOL INC·Filed 2002·Granted Oct 28, 2003·110 cites·24 claims
- 0596US6277263B1Apparatus and method for electrolytically depositing copper on a semiconductor workpieceSEMITOOL INC·Filed 1999·Granted Aug 21, 2001·151 cites·30 claims
- 0695US6290833B1Method for electrolytically depositing copper on a semiconductor workpieceSEMITOOL INC·Filed 1999·Granted Sep 18, 2001·121 cites·27 claims
- 0794USD828342SSmart home hubSHENZHEN ZHIQU TECH LIMITED·Filed 2017·Granted Sep 11, 2018·80 cites·1 claims
- 0894US7332066B2Apparatus and method for electrochemically depositing metal on a semiconductor workpieceSEMITOOL INC·Filed 2005·Granted Feb 19, 2008·19 cites·38 claims
- 0994US6309520B1Methods and apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 1999·Granted Oct 30, 2001·92 cites·61 claims
- 1093US6632345B1Apparatus and method for electrolytically depositing a metal on a workpieceSEMITOOL INC·Filed 2000·Granted Oct 14, 2003·47 cites·12 claims
- 1193US6309524B1Methods and apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 1999·Granted Oct 30, 2001·107 cites·39 claims
- 1290US6508920B1Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic deviceSEMITOOL INC·Filed 1999·Granted Jan 21, 2003·88 cites·53 claims
- 1389US6811675B2Apparatus and method for electrolytically depositing copper on a semiconductor workpieceSEMITOOL INC·Filed 2001·Granted Nov 2, 2004·31 cites·27 claims
- 1489US6699373B2Apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 2001·Granted Mar 2, 2004·40 cites·42 claims
- 1587US6869510B2Methods and apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 2001·Granted Mar 22, 2005·26 cites·21 claims
- 1687US6303010B1Methods and apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 1999·Granted Oct 16, 2001·81 cites·8 claims
- 1785US7135404B2Method for applying metal features onto barrier layers using electrochemical depositionSEMITOOL INC·Filed 2003·Granted Nov 14, 2006·24 cites·22 claims
- 1884US6527925B1Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2000·Granted Mar 4, 2003·23 cites·32 claims
- 1982US6806186B2Submicron metallization using electrochemical depositionSEMITOOL INC·Filed 2001·Granted Oct 19, 2004·21 cites·22 claims
- 2081US6911127B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted Jun 28, 2005·17 cites·42 claims
- 2178US6306276B1Aqueous electrodeposition of rare earth and transition metalsUNIV CALIFORNIA·Filed 1998·Granted Oct 23, 2001·39 cites·20 claims
- 2276US6743719B1Method for forming a conductive copper structureTEXAS INSTRUMENTS INC·Filed 2003·Granted Jun 1, 2004·23 cites·18 claims
- 2375US6645356B1Methods and apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 1999·Granted Nov 11, 2003·28 cites·56 claims
- 2473US7115196B2Apparatus and method for electrochemically depositing metal on a semiconductor workpieceSEMITOOL INC·Filed 2003·Granted Oct 3, 2006·11 cites·12 claims
- 2572US6730597B1Pre-ECD wet surface modification to improve wettability and reduced void defectTEXAS INSTRUMENTS INC·Filed 2000·Granted May 4, 2004·13 cites·17 claims
- 2670US6919013B2Apparatus and method for electrolytically depositing copper on a workpieceSEMITOOL INC·Filed 2003·Granted Jul 19, 2005·7 cites·30 claims
- 2769US6998275B2Hydrogen-less CVD TiN process for FeRAM VIA0 barrier applicationTEXAS INSTRUMENTS INC·Filed 2003·Granted Feb 14, 2006·15 cites·11 claims
- 2867US7144805B2Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current densitySEMITOOL INC·Filed 2004·Granted Dec 5, 2006·8 cites·29 claims
- 2963US6899805B2Automated chemical management system executing improved electrolyte analysis methodSEMITOOL INC·Filed 2001·Granted May 31, 2005·4 cites·26 claims
- 3060US6939448B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted Sep 6, 2005·6 cites·29 claims
- 3159US7462269B2Method for low temperature annealing of metallization micro-structures in the production of a microelectronic deviceSEMITOOL INC·Filed 2001·Granted Dec 9, 2008·5 cites·33 claims
- 3259US6908851B2Corrosion resistance for copper interconnectsTEXAS INSTRUMENTS INC·Filed 2003·Granted Jun 21, 2005·8 cites·25 claims
- 3359US2025363289A1Artificial intelligence (ai)-assisted post editingLEMON INC·Filed 2024·Application pending·0 cites
- 3459US2025377775A1User interfaces for media managementLEMON INC·Filed 2024·Application pending·0 cites
- 3558US7048841B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted May 23, 2006·5 cites·5 claims
- 3656US11130761B2Substituted pyrrolo[2,1-f][1,2,4]triazines as FGFR inhibitorsCSPC ZHONGQI PHARMACEUTICAL TECH SHIJIAZHUANG CO LTD·Filed 2017·Granted Sep 28, 2021·0 cites·20 claims
- 3754US7067015B2Modified clean chemistry and megasonic nozzle for removing backside CMP slurriesTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 27, 2006·4 cites·17 claims
- 3854US2024362890A1Data processing method and deviceSMARTER SILICON SHANGHAI TECH CO LTD·Filed 2024·Application pending·0 cites
- 3954US2010116671A1Apparatus and method for electrochemically depositing metal on a semiconductor workpieceSEMITOOL INC·Filed 2006·Application pending·0 cites
- 4053US6994776B2Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic deviceSEMITOOL INC·Filed 2001·Granted Feb 7, 2006·5 cites·6 claims
- 4152US2005139478A1Apparatus and method for electrolytically depositing copper on a semiconductor workpieceSEMITOOL INC·Filed 2005·Application pending·0 cites
- 4252US2025259356A1Method for generating image collection, electronic device, and computer storage mediumBEIJING ZITIAO NETWORK TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 4352US2005150770A1Apparatus and method for electrolytically depositing copper on a semiconductor workpieceSEMITOOL INC·Filed 2005·Application pending·0 cites
- 4451US2006079085A1Method for applying metal features onto metallized layers using electrochemical depositionSEMITOOL INC·Filed 2005·Application pending·0 cites
- 4551US2006079083A1Method for applying metal features onto metallized layers using electrochemical deposition using acid treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 4651US2006079084A1Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 4751US2005189213A1Method and apparatus for copper plating using electroless plating and electroplatingFiled 2005·Application pending·0 cites
- 4851US2006084264A1Method for applying metal features onto metallized layers using electrochemical deposition and alloy treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 4949US7198705B2Plating-rinse-plating process for fabricating copper interconnectsTEXAS INSTRUMENTS INC·Filed 2002·Granted Apr 3, 2007·2 cites·8 claims
- 5048US2021348217A1Rna tickertape for recording transcriptional histories of cellsMASSACHUSETTS INST TECHNOLOGY·Filed 2019·Application pending·0 cites
Showing the top 50 of 61 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →