Inventor · disambiguated record
Masayo Kurii
Also filed as: KURII MASAYO
3 granted patents·2 citations·filing 2013–2016
53Inventor score
Files withMEC CO LTD3
Top patents by PatentIndex Score
3 records- 0171US9011712B2Microetching solution for copper, replenishment solution therefor and method for production of wiring boardMEC CO LTD·Filed 2013·Granted Apr 21, 2015·2 cites·10 claims
- 0252US9441303B2Microetching solution for copper, replenishment solution therefor and method for production of wiring boardMEC CO LTD·Filed 2013·Granted Sep 13, 2016·0 cites·11 claims
- 0350US9932678B2Microetching solution for copper, replenishment solution therefor and method for production of wiring boardMEC CO LTD·Filed 2016·Granted Apr 3, 2018·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →