Inventor · disambiguated record
David Pidwerbecki
Also filed as: PIDWERBECKI DAVID
40 granted patents·5 pending applications·340 citations·filing 1997–2023
97Inventor score
Files withINTEL CORP28HEWLETT PACKARD CO7HEWLETT PACKARD DEVELOPMENT CO3PIDWERBECKI DAVID3BANERJEE NEEL1
Top patents by PatentIndex Score
45 records- 0193US9980412B2Flexible heat spreaderINTEL CORP·Filed 2016·Granted May 22, 2018·16 cites·23 claims
- 0290US9483126B2Smart variable torque displayINTEL CORP·Filed 2016·Granted Nov 1, 2016·6 cites·18 claims
- 0389US9313875B2Conformal coating including embedded thermal energy absorbing materialINTEL CORP·Filed 2012·Granted Apr 12, 2016·9 cites·17 claims
- 0488US6146915AReduced size printhead for an inkjet printerHEWLETT PACKARD CO·Filed 1999·Granted Nov 14, 2000·56 cites·4 claims
- 0587US9226428B2High heat capacity electronic components and methods for fabricatingPIDWERBECKI DAVID·Filed 2012·Granted Dec 29, 2015·10 cites·27 claims
- 0686US9353560B2Smart variable torque displayINTEL CORP·Filed 2014·Granted May 31, 2016·7 cites·12 claims
- 0786US8757750B2Crosstalk reduction in piezo printheadBANERJEE NEEL·Filed 2010·Granted Jun 24, 2014·5 cites·20 claims
- 0885US11231757B2Thermal dissipation in dual-chassis devicesINTEL CORP·Filed 2018·Granted Jan 25, 2022·6 cites·18 claims
- 0984US12337848B2Road surface friction based predictive driving for computer assisted or autonomous driving vehiclesINTEL CORP·Filed 2023·Granted Jun 24, 2025·0 cites·21 claims
- 1084US6489084B1Fine detail photoresist barrierHEWLETT PACKARD CO·Filed 2000·Granted Dec 3, 2002·25 cites·10 claims
- 1183US11755080B2Thermal dissipation in dual-chassis devicesINTEL CORP·Filed 2021·Granted Sep 12, 2023·1 cites·14 claims
- 1282US11267475B2Road surface friction based predictive driving for computer assisted or autonomous driving vehiclesINTEL CORP·Filed 2020·Granted Mar 8, 2022·1 cites·22 claims
- 1382US9337628B2Ionic cooling assembly for electronic deviceINTEL CORP·Filed 2013·Granted May 10, 2016·4 cites·25 claims
- 1481US6145963AReduced size printhead for an inkjet printerHEWLETT PACKARD CO·Filed 1997·Granted Nov 14, 2000·37 cites·4 claims
- 1579US8141990B2Ink ejection devicePIDWERBECKI DAVID·Filed 2009·Granted Mar 27, 2012·5 cites·10 claims
- 1678US9715255B2Belt driven hinge assembly for electronic devicesINTEL CORP·Filed 2014·Granted Jul 25, 2017·4 cites·15 claims
- 1778US6007188AParticle tolerant printheadHEWLETT PACKARD CO·Filed 1997·Granted Dec 28, 1999·41 cites·17 claims
- 1877US10576986B2Road surface friction based predictive driving for computer assisted or autonomous driving vehiclesINTEL CORP·Filed 2017·Granted Mar 3, 2020·2 cites·25 claims
- 1977US6293654B1Printhead apparatusHEWLETT PACKARD CO·Filed 1998·Granted Sep 25, 2001·34 cites·20 claims
- 2076US11807243B2Road surface friction based predictive driving for computer assisted or autonomous driving vehiclesINTEL CORP·Filed 2022·Granted Nov 7, 2023·0 cites·31 claims
- 2176US11567508B2Autonomous unmanned vehicles for responding to situationsINTEL CORP·Filed 2017·Granted Jan 31, 2023·3 cites·24 claims
- 2276US9971382B2Super-elastic hinge for flexible displayINTEL CORP·Filed 2016·Granted May 15, 2018·4 cites·22 claims
- 2376US6161923AFine detail photoresist barrierHEWLETT PACKARD CO·Filed 1998·Granted Dec 19, 2000·32 cites·15 claims
- 2470US7854497B2Fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Dec 21, 2010·3 cites·23 claims
- 2568US9847624B2Ionic cooling assembly for electronic deviceINTEL CORP·Filed 2016·Granted Dec 19, 2017·1 cites·20 claims
- 2664US6402296B1High resolution inkjet printerHEWLETT PACKARD CO·Filed 1998·Granted Jun 11, 2002·21 cites·10 claims
- 2760US10804168B2Induced warpage of a thermal conductorINTEL CORP·Filed 2019·Granted Oct 13, 2020·0 cites·19 claims
- 2859US7922302B2Piezoelectric actuation mechanismHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Apr 12, 2011·1 cites·20 claims
- 2958US2024210988A1Composite Materials for Electronic Device Chassis and Related MethodsINTEL CORP·Filed 2023·Application pending·0 cites
- 3057US9425543B2Protective cover for a connectorINTEL CORP·Filed 2014·Granted Aug 23, 2016·2 cites·15 claims
- 3156US10305529B2Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devicesPIDWERBECKI DAVID·Filed 2013·Granted May 28, 2019·1 cites·16 claims
- 3256US2015375472A1Computing device having biomimetic materialSPRENGER MARK·Filed 2014·Application pending·0 cites
- 3355US10418291B2Induced warpage of a thermal conductorINTEL CORP·Filed 2017·Granted Sep 17, 2019·0 cites·10 claims
- 3454US9765439B2Electroplated plastic chassis for electronic deviceINTEL CORP·Filed 2014·Granted Sep 19, 2017·0 cites·8 claims
- 3551US9451716B1Serviceable chassis for devicesINTEL CORP·Filed 2015·Granted Sep 20, 2016·0 cites·20 claims
- 3650US2023309262A1Flow enhancement structure for immersion cooled electronic systemsINTEL CORP·Filed 2023·Application pending·0 cites
- 3749US10027160B2Integration of wireless charging coil to a chassisINTEL CORP·Filed 2016·Granted Jul 17, 2018·0 cites·19 claims
- 3848US8348393B2Print head diaphragm supportHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted Jan 8, 2013·0 cites·19 claims
- 3943US10152100B2Retractable heat exchangerINTEL CORP·Filed 2016·Granted Dec 11, 2018·0 cites·16 claims
- 4042US2019040554A1Heat spreading clothsINTEL CORP·Filed 2018·Application pending·0 cites
- 4141US9426914B2Film insert molding for device manufactureDAVISON PETER·Filed 2012·Granted Aug 23, 2016·0 cites·9 claims
- 4240US11545410B2Enhanced systems and methods for improved heat transfer from semiconductor packagesINTEL CORP·Filed 2018·Granted Jan 3, 2023·0 cites·19 claims
- 4340USD810031SProtective cover for an electronic connectorINTEL CORP·Filed 2014·Granted Feb 13, 2018·3 cites·1 claims
- 4440US2019045658A1Thermal technologies incorporating super-elastic materialsINTEL CORP·Filed 2017·Application pending·0 cites
- 4528US9199455B2PrintheadVANDENBERGHE KENNETH L·Filed 2011·Granted Dec 1, 2015·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →