Inventor · disambiguated record
Walter Leitgeb
Also filed as: LEITGEB WALTER · LEITGEB WALTER HORST
11 granted patents·2 pending applications·22 citations·filing 1980–2023
84Inventor score
Top patents by PatentIndex Score
13 records- 0180US12148640B2Method and apparatus for use in wafer processingINFINEON TECHNOLOGIES AG·Filed 2023·Granted Nov 19, 2024·0 cites·19 claims
- 0279US10186438B2Method and apparatus for use in wafer processingINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 22, 2019·2 cites·15 claims
- 0375US11594439B2Frame cassette for holding tape-framesINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 28, 2023·2 cites·22 claims
- 0472US11637028B2Method and apparatus for use in wafer processingINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 25, 2023·0 cites·19 claims
- 0568US11088009B2Support table, support table assembly, processing arrangement, and methods thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 10, 2021·1 cites·24 claims
- 0662US10985041B2Method and apparatus for use in wafer processingINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 20, 2021·0 cites·20 claims
- 0759US12205842B2Wafer chuck for a laser beam wafer dicing equipmentINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jan 21, 2025·0 cites·19 claims
- 0858US4330940ADevice for measuring the oil level in closed housingsKLOECKNER HUMBOLDT DEUTZ AG·Filed 1980·Granted May 25, 1982·17 cites·5 claims
- 0953US11251097B2Method and device for monitoring dicing tape tensionINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 1049US11309196B2Detection of adhesive residue on a waferINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 19, 2022·0 cites·19 claims
- 1149US2023100613A1Wafer chuck for a laser beam wafer dicing equipmentINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1247US10020215B2Frame cassetteINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 10, 2018·0 cites·17 claims
- 1346US2015214084A1Frame cassetteINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →