Inventor · disambiguated record
Layal Rouhana
Also filed as: ROUHANA LAYAL · ROUHANA LAYAL L
4 granted patents·4 pending applications·16 citations·filing 2012–2018
68Inventor score
Files withQUALCOMM INC8
Top patents by PatentIndex Score
8 records- 0191US9496213B2Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrateQUALCOMM INC·Filed 2015·Granted Nov 15, 2016·11 cites·30 claims
- 0277US10157824B2Integrated circuit (IC) package and package substrate comprising stacked viasQUALCOMM INC·Filed 2017·Granted Dec 18, 2018·3 cites·31 claims
- 0367US9355898B2Package on package (PoP) integrated device comprising a plurality of solder resist layersQUALCOMM INC·Filed 2014·Granted May 31, 2016·2 cites·22 claims
- 0445US10651160B2Low profile integrated packageQUALCOMM INC·Filed 2018·Granted May 12, 2020·0 cites·29 claims
- 0544US2016093567A1System, apparatus, and method of interconnection in a substrateQUALCOMM INC·Filed 2014·Application pending·0 cites
- 0643US2014138129A1Substrate having a low coefficient of thermal expansion (cte) copper composite materialQUALCOMM INC·Filed 2012·Application pending·0 cites
- 0736US2019067178A1Fine pitch and spacing interconnects with reserve interconnect portionQUALCOMM INC·Filed 2017·Application pending·0 cites
- 0834US2016183386A1Techniques for controlling equivalent series resistance of a capacitorQUALCOMM INC·Filed 2015·Application pending·0 cites
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