Inventor · disambiguated record
Brian J. Coppa
Also filed as: COPPA BRIAN · COPPA BRIAN J
16 granted patents·1 pending application·217 citations·filing 2006–2024
94Inventor score
Files withMICRON TECHNOLOGY INC6TOKYO ELECTRON LTD4AMBATURE INC2LODESTAR LICENSING GROUP LLC2GILBERT DOUGLAS J1
Top patents by PatentIndex Score
17 records- 0195US9761457B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 12, 2017·7 cites·8 claims
- 0295US8852851B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameZHOU BAOSUO·Filed 2006·Granted Oct 7, 2014·23 cites·10 claims
- 0394US10446453B2Surface modification control for etch metric enhancementTOKYO ELECTRON LTD·Filed 2018·Granted Oct 15, 2019·43 cites·35 claims
- 0494US10304668B2Localized process control using a plasma systemTOKYO ELECTRON LTD·Filed 2017·Granted May 28, 2019·46 cites·43 claims
- 0594US10096483B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 9, 2018·6 cites·8 claims
- 0693US10773282B2Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopyTOKYO ELECTRON LTD·Filed 2017·Granted Sep 15, 2020·45 cites·16 claims
- 0792US10607844B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 31, 2020·4 cites·4 claims
- 0892US10333047B2Electrical, mechanical, computing/ and/or other devices formed of extremely low resistance materialsGILBERT DOUGLAS J·Filed 2012·Granted Jun 25, 2019·21 cites·12 claims
- 0990US12463044B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Nov 4, 2025·0 cites·12 claims
- 1088US11289639B2Electrical, mechanical, computing, and/or other devices formed of extremely low resistance materialsAMBATURE INC·Filed 2019·Granted Mar 29, 2022·9 cites·20 claims
- 1183US9305782B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 5, 2016·3 cites·10 claims
- 1282US11935756B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Mar 19, 2024·0 cites·8 claims
- 1380US8129289B2Method to deposit conformal low temperature SiO2SMYTHE JOHN A·Filed 2006·Granted Mar 6, 2012·10 cites·22 claims
- 1474US11335563B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2020·Granted May 17, 2022·0 cites·7 claims
- 1569US12063874B2Electrical, mechanical, computing, and/or other devices formed of extremely low resistance materialsAMBATURE INC·Filed 2022·Granted Aug 13, 2024·0 cites·17 claims
- 1657US11273469B2Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopyTOKYO ELECTRON LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 1744US2008179715A1Shallow trench isolation using atomic layer deposition during fabrication of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2007·Application pending·0 cites
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