Inventor · disambiguated record
Tung-Hsien Hsieh
Also filed as: HSIEH TUNG-HSIEN
21 granted patents·7 pending applications·91 citations·filing 2007–2022
93Inventor score
Top patents by PatentIndex Score
28 records- 0196US7786557B2QFN Semiconductor packageMEDIATEK INC·Filed 2009·Granted Aug 31, 2010·35 cites·14 claims
- 0291US10079192B2Semiconductor chip package assembly with improved heat dissipation performanceMEDIATEK INC·Filed 2016·Granted Sep 18, 2018·8 cites·15 claims
- 0389US8044496B2QFN semiconductor packageMEDIATEK INC·Filed 2010·Granted Oct 25, 2011·9 cites·12 claims
- 0484US7636170B1Static/dynamic multi-function measuring device for linear unitUNIV NAT FORMOSA·Filed 2008·Granted Dec 22, 2009·17 cites·9 claims
- 0579US10571259B2Optical detecting apparatus for detecting a degree of freedom error of a spindle and a detecting method thereofUNIV NAT FORMOSA·Filed 2017·Granted Feb 25, 2020·3 cites·8 claims
- 0674US9704808B2Semiconductor device and wafer level package including such semiconductor deviceMEDIATEK INC·Filed 2016·Granted Jul 11, 2017·2 cites·26 claims
- 0771US8039933B2QFN semiconductor packageMEDIATEK INC·Filed 2010·Granted Oct 18, 2011·2 cites·12 claims
- 0869US10147674B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Dec 4, 2018·1 cites·24 claims
- 0968US10224287B2Semiconductor device and wafer level package including such semiconductor deviceMEDIATEK INC·Filed 2017·Granted Mar 5, 2019·1 cites·17 claims
- 1068US9331054B2Semiconductor package assembly with decoupling capacitorMEDIATEK INC·Filed 2014·Granted May 3, 2016·2 cites·28 claims
- 1167US8084853B2Semiconductor flip chip package utilizing wire bonding for net switchingHSIEH TUNG-HSIEN·Filed 2009·Granted Dec 27, 2011·4 cites·23 claims
- 1265US8288870B2Semiconductor chip package and method for designing the sameHSIEH TUNG-HSIEN·Filed 2010·Granted Oct 16, 2012·2 cites·18 claims
- 1363US9704785B2Semiconductor package with die paddleMEDIATEK INC·Filed 2015·Granted Jul 11, 2017·1 cites·27 claims
- 1463US7773234B2Means for measuring a working machine's structural deviation from five reference axesUNIV NAT FORMOSA·Filed 2008·Granted Aug 10, 2010·3 cites·20 claims
- 1560US12158482B2Probe card assemblyMEDIATEK INC·Filed 2021·Granted Dec 3, 2024·0 cites·18 claims
- 1659US7884481B2Semiconductor chip package and method for designing the sameMEDIATEK INC·Filed 2007·Granted Feb 8, 2011·1 cites·9 claims
- 1757US12442694B2Drive system thermal temperature rise test and compensation systemUNIV NAT TAIWAN·Filed 2022·Granted Oct 14, 2025·0 cites·7 claims
- 1850US8039319B2Method for fabricating QFN semiconductor packageMEDIATEK INC·Filed 2010·Granted Oct 18, 2011·0 cites·11 claims
- 1948US9704792B2Semiconductor package assemblyMEDIATEK INC·Filed 2016·Granted Jul 11, 2017·0 cites·20 claims
- 2044US2010283141A1Semiconductor chip packageCHANG CHUN-WEI·Filed 2009·Application pending·0 cites
- 2144US2010213588A1Wire bond chip packageHSIEH TUNG-HSIEN·Filed 2009·Application pending·0 cites
- 2242US2013277801A1Chip packageMEDIATEK INC·Filed 2013·Application pending·0 cites
- 2342US2014042615A1Flip-chip packageMEDIATEK INC·Filed 2013·Application pending·0 cites
- 2440US2013020699A1Package structure and method for fabricating the sameMEDIATEK INC·Filed 2012·Application pending·0 cites
- 2539US9244458B2Method of numerical-control scraping of a work pieceJYWE WEN-YUH·Filed 2012·Granted Jan 26, 2016·0 cites·7 claims
- 2635US2011042794A1Qfn semiconductor package and circuit board structure adapted for the sameHSIEH TUNG-HSIEN·Filed 2010·Application pending·0 cites
- 2734US2010213589A1Multi-chip packageHSIEH TUNG-HSIEN·Filed 2010·Application pending·0 cites
- 2830US11290571B2Many-to-many state identification system of equipment names that are broadcasted from Internet-of-ThingsUNIV NAT FORMOSA·Filed 2020·Granted Mar 29, 2022·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →