Inventor · disambiguated record
Dzafir Bin Mohd Shariff
Also filed as: SHARIFF DZAFIR · SHARIFF DZAFIR BIN MOHD
5 granted patents·7 pending applications·4 citations·filing 2012–2023
63Inventor score
Top patents by PatentIndex Score
12 records- 0165US9824923B2Semiconductor device and method of forming conductive pillar having an expanded baseSHARIFF DZAFIR·Filed 2012·Granted Nov 21, 2017·4 cites·18 claims
- 0250US2025038037A1Wafer lamination systems and methods thereof for semiconductor wafersUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 0348US12165921B2Wafer adaptor for adapting different sized wafersUTAC HEADQUARTERS PTE LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 0448US2023343668A1Semiconductor Packages and Methods of Forming RDL and Side and Back Protection for Semiconductor DeviceUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 0547US11670549B2Semiconductor packages without debrisUTAC HEADQUARTERS PTE LTD·Filed 2020·Granted Jun 6, 2023·0 cites·20 claims
- 0646US2023274979A1Plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 0745US2023178413A1Plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 0845US2023154795A1Frame mask for singulating wafers by plasma etchingUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 0943US2023377896A1Back surface plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 1042US11710661B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2020·Granted Jul 25, 2023·0 cites·20 claims
- 1140US2023154796A1Plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 1235US10714431B2Semiconductor packages with electromagnetic interference shieldingUTAC HEADQUARTERS PTE LTD·Filed 2018·Granted Jul 14, 2020·0 cites·20 claims
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