Inventor · disambiguated record
Dorel I. Toma
Also filed as: TOMA DOREL · TOMA DOREL I · TOMA DOREL IOAN
22 granted patents·7 pending applications·2,191 citations·filing 2003–2016
96Inventor score
Top patents by PatentIndex Score
29 records- 0198US9443725B2Multi-step system and method for curing a dielectric filmTOKYO ELECTRON LTD·Filed 2015·Granted Sep 13, 2016·465 cites·20 claims
- 0298US9017933B2Method for integrating low-k dielectricsLIU JUNJUN·Filed 2011·Granted Apr 28, 2015·463 cites·21 claims
- 0398US7977256B2Method for removing a pore-generating material from an uncured low-k dielectric filmTOKYO ELECTRON LTD·Filed 2008·Granted Jul 12, 2011·504 cites·24 claims
- 0498US7858533B2Method for curing a porous low dielectric constant dielectric filmTOKYO ELECTRON LTD·Filed 2008·Granted Dec 28, 2010·522 cites·26 claims
- 0595US8895942B2Dielectric treatment module using scanning IR radiation sourceLIU JUNJUN·Filed 2008·Granted Nov 25, 2014·44 cites·30 claims
- 0693US7405168B2Plural treatment step process for treating dielectric filmsTOKYO ELECTRON LTD·Filed 2005·Granted Jul 29, 2008·26 cites·48 claims
- 0792US7666754B2Method and system for forming an air gap structureTOKYO ELECTRON LTD·Filed 2007·Granted Feb 23, 2010·21 cites·17 claims
- 0892US7345000B2Method and system for treating a dielectric filmTOKYO ELECTRON LTD·Filed 2005·Granted Mar 18, 2008·23 cites·25 claims
- 0989US7901743B2Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing systemTOKYO ELECTRON LTD·Filed 2005·Granted Mar 8, 2011·15 cites·13 claims
- 1088US7855123B2Method of integrating an air gap structure with a substrateTOKYO ELECTRON LTD·Filed 2009·Granted Dec 21, 2010·13 cites·22 claims
- 1183US10068765B2Multi-step system and method for curing a dielectric filmTOKYO ELECTRON LTD·Filed 2016·Granted Sep 4, 2018·2 cites·16 claims
- 1283US7115993B2Structure comprising amorphous carbon film and method of forming thereofTOKYO ELECTRON LTD·Filed 2004·Granted Oct 3, 2006·37 cites·17 claims
- 1377US7553769B2Method for treating a dielectric filmTOKYO ELECTRON LTD·Filed 2003·Granted Jun 30, 2009·19 cites·10 claims
- 1475US8039049B2Treatment of low dielectric constant films using a batch processing systemTOKYO ELECTRON LTD·Filed 2005·Granted Oct 18, 2011·5 cites·19 claims
- 1574US7199046B2Structure comprising tunable anti-reflective coating and method of forming thereofTOKYO ELECTRON LTD·Filed 2003·Granted Apr 3, 2007·15 cites·10 claims
- 1672US8242460B2Ultraviolet treatment apparatusYUE HONGYU·Filed 2011·Granted Aug 14, 2012·3 cites·20 claims
- 1772US7807213B2Method and system for characterizing porous materialsTOKYO ELECTRON LTD·Filed 2007·Granted Oct 5, 2010·3 cites·21 claims
- 1866US7829268B2Method for air gap formation using UV-decomposable materialsTOKYO ELECTRON LTD·Filed 2007·Granted Nov 9, 2010·2 cites·21 claims
- 1964US7270941B2Method of passivating of low dielectric materials in wafer processingTOKYO ELECTRON LTD·Filed 2003·Granted Sep 18, 2007·9 cites·24 claims
- 2048US2010068897A1Dielectric treatment platform for dielectric film deposition and curingTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2148US2010065758A1Dielectric material treatment system and method of operatingTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2248US2010067886A1Ir laser optics system for dielectric treatment moduleTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2346US2009226695A1Method for treating a dielectric film with infrared radiationTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2446US2009226694A1POROUS SiCOH-CONTAINING DIELECTRIC FILM AND A METHOD OF PREPARINGTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2545US2009075491A1Method for curing a dielectric filmTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 2643US7238382B2Method and system for characterizing porous materialsTOKYO ELECTRON LTD·Filed 2004·Granted Jul 3, 2007·0 cites·18 claims
- 2742US8956457B2Thermal processing system for curing dielectric filmsLEE ERIC M·Filed 2006·Granted Feb 17, 2015·0 cites·20 claims
- 2838US2012225568A1Annealing method and annealing apparatusIZAWA YUSAKU·Filed 2012·Application pending·0 cites
- 2932US8444848B2Electrochemical substrate slicing using electromagnetic wave excitationYUE HONGYU H·Filed 2010·Granted May 21, 2013·0 cites·19 claims
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