Inventor · disambiguated record
Susan H. Downey
Also filed as: DOWNEY SUSAN H
11 granted patents·1 pending application·628 citations·filing 1994–2007
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0197US6614091B1Semiconductor device having a wire bond pad and method thereforMOTOROLA INC·Filed 2002·Granted Sep 2, 2003·214 cites·9 claims
- 0295US6998952B2Inductive device including bond wiresFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Feb 14, 2006·137 cites·26 claims
- 0394US6717270B1Integrated circuit die I/O cellsMOTOROLA INC·Filed 2003·Granted Apr 6, 2004·119 cites·33 claims
- 0489US7626276B2Method and apparatus for providing structural support for interconnect pad while allowing signal conductanceFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Dec 1, 2009·17 cites·19 claims
- 0589US7138328B2Packaged IC using insulated wireFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Nov 21, 2006·46 cites·23 claims
- 0676US6921979B2Semiconductor device having a bond pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jul 26, 2005·27 cites·33 claims
- 0773US7241636B2Method and apparatus for providing structural support for interconnect pad while allowing signal conductanceFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jul 10, 2007·5 cites·20 claims
- 0873US6846717B2Semiconductor device having a wire bond pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jan 25, 2005·17 cites·15 claims
- 0956US5531838AFlux composition and corresponding soldering methodIBM·Filed 1995·Granted Jul 2, 1996·22 cites·6 claims
- 1054US5615827AFlux composition and corresponding soldering methodIBM·Filed 1994·Granted Apr 1, 1997·22 cites·10 claims
- 1145US7015585B2Packaged integrated circuit having wire bonds and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Mar 21, 2006·2 cites·8 claims
- 1239US2004119172A1Packaged IC using insulated wireFiled 2002·Application pending·0 cites
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