Inventor · disambiguated record
Toshitsune Iijima
Also filed as: IIJIMA TOSHITSUNE
6 granted patents·4 pending applications·92 citations·filing 1999–2011
83Inventor score
Top patents by PatentIndex Score
10 records- 0185US7138297B2Method of dividing a semiconductor wafer utilizing a laser dicing techniqueTOSHIBA KK·Filed 2004·Granted Nov 21, 2006·40 cites·9 claims
- 0272US7091624B2Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the sameTOSHIBA KK·Filed 2003·Granted Aug 15, 2006·18 cites·23 claims
- 0363US8673690B2Method for manufacturing a semiconductor device and a semiconductor deviceIIJIMA TOSHITSUNE·Filed 2011·Granted Mar 18, 2014·3 cites·7 claims
- 0456US6429372B1Semiconductor device of surface mounting type and method for fabricating the sameTOSHIBA KK·Filed 1999·Granted Aug 6, 2002·26 cites·34 claims
- 0543USD473198SSemiconductor deviceTOSHIBA KK·Filed 2002·Granted Apr 15, 2003·5 cites·1 claims
- 0637US2011221066A1Method for manufacturing a semiconductor device and a semiconductor deviceWATANABE KAZUHIRO·Filed 2011·Application pending·0 cites
- 0736US2004169258A1Semiconductor wafer having separation groove on insulating film on dicing line region and its manufacturing methodTOSHIBA KK·Filed 2003·Application pending·0 cites
- 0833US6713869B2Wiring pattern of semiconductor deviceTOSHIBA KK·Filed 2002·Granted Mar 30, 2004·0 cites·6 claims
- 0933US2010213599A1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2010·Application pending·0 cites
- 1033US2004155358A1First and second level packaging assemblies and method of assembling packageFiled 2003·Application pending·0 cites
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