Inventor · disambiguated record
Yong Hui Joo
Also filed as: JOO YONG HUI
1 granted patent·3 pending applications·4 citations·filing 2011–2014
25Inventor score
Top patents by PatentIndex Score
4 records- 0171US8630097B2Power module using sintering die attach and manufacturing method thereofKIM TAE HYUN·Filed 2011·Granted Jan 14, 2014·4 cites·7 claims
- 0232US2014027049A1Chip ejector and chip removal method using the sameJOO YONG HUI·Filed 2012·Application pending·0 cites
- 0330US2012122278A1Method Of Manufacturing Semiconductor Package BoardLEE KWAN HO·Filed 2011·Application pending·0 cites
- 0429US2015287639A1Semiconductor chip, board having the same mounted thereon, and method of cutting semiconductor waferSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →