Inventor · disambiguated record
Paul Rissman
Also filed as: RISSMAN PAUL
8 granted patents·1 pending application·577 citations·filing 1982–2009
89Inventor score
Files withLSI LOGIC CORP3GLEASON ROBERT P1HEWLETT PACKARD CO1HEWLETT PACKARD DEVELOPMENT CO1LSI LOGIC CORP MILPITAS CA1
Top patents by PatentIndex Score
9 records- 0195US6552743B1Digital camera-ready printerHEWLETT PACKARD DEVELOPMENT CO·Filed 1998·Granted Apr 22, 2003·356 cites·21 claims
- 0294US6566262B1Method for creating self-aligned alloy capping layers for copper interconnect structuresLSI LOGIC CORP·Filed 2001·Granted May 20, 2003·83 cites·23 claims
- 0385US4463265AElectron beam proximity effect correction by reverse field pattern exposureHEWLETT PACKARD CO·Filed 1982·Granted Jul 31, 1984·63 cites·8 claims
- 0481US7793253B2Mask-patterns including intentional breaksLUMINESCENT TECHNOLOGIES INC·Filed 2006·Granted Sep 7, 2010·6 cites·23 claims
- 0571US5661043AForming a buried insulator layer using plasma source ion implantationFiled 1994·Granted Aug 26, 1997·55 cites·20 claims
- 0667US8082524B2Mask patterns for use in multiple-exposure lithographyGLEASON ROBERT P·Filed 2009·Granted Dec 20, 2011·5 cites·23 claims
- 0759US6986972B1Alternating aperture phase-shift mask fabrication methodLSI LOGIC CORP·Filed 2003·Granted Jan 17, 2006·7 cites·18 claims
- 0847US6747358B1Self-aligned alloy capping layers for copper interconnect structuresLSI LOGIC CORP·Filed 2003·Granted Jun 8, 2004·2 cites·12 claims
- 0937US2004241554A1Ion implantation phase shift maskLSI LOGIC CORP MILPITAS CA·Filed 2003·Application pending·0 cites
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