Inventor · disambiguated record
Mark V. Pierson
Also filed as: PIERSON MARK V · PIERSON MARK VINCENT
105 granted patents·2 pending applications·4,117 citations·filing 1976–2021
99Inventor score
Top patents by PatentIndex Score
107 records- 0199US6165885AMethod of making components with solder ballsIBM·Filed 1998·Granted Dec 26, 2000·265 cites·7 claims
- 0298US6497943B1Surface metal balancing to reduce chip carrier flexingIBM·Filed 2000·Granted Dec 24, 2002·162 cites·17 claims
- 0398US6358627B2Rolling ball connectorIBM·Filed 2001·Granted Mar 19, 2002·164 cites·7 claims
- 0498US5872051AProcess for transferring material to semiconductor chip conductive pads using a transfer substrateIBM·Filed 1995·Granted Feb 16, 1999·189 cites·9 claims
- 0597US6759738B1Systems interconnected by bumps of joining materialIBM·Filed 1999·Granted Jul 6, 2004·133 cites·3 claims
- 0697US6399892B1CTE compensated chip interposerIBM·Filed 2000·Granted Jun 4, 2002·91 cites·20 claims
- 0797US5315227ASolar recharge station for electric vehiclesPIERSON MARK V·Filed 1993·Granted May 24, 1994·340 cites·10 claims
- 0896US6674647B2Low or no-force bump flattening structure and methodIBM·Filed 2002·Granted Jan 6, 2004·92 cites·5 claims
- 0994US6559666B2Method and device for semiconductor testing using electrically conductive adhesivesIBM·Filed 2001·Granted May 6, 2003·80 cites·16 claims
- 1093US6664637B2Flip chip C4 extension structure and processIBM·Filed 2001·Granted Dec 16, 2003·63 cites·26 claims
- 1193US6177729B1Rolling ball connectorIBM·Filed 1999·Granted Jan 23, 2001·84 cites·23 claims
- 1293US5420520AMethod and apparatus for testing of integrated circuit chipsIBM·Filed 1993·Granted May 30, 1995·128 cites·3 claims
- 1392US8272533B1No touch utensil dispenserD AMELIA ANTHONY·Filed 2010·Granted Sep 25, 2012·80 cites·10 claims
- 1492US6516513B2Method of making a CTE compensated chip interposerIBM·Filed 2002·Granted Feb 11, 2003·41 cites·13 claims
- 1592US5818107AChip stacking by edge metallizationIBM·Filed 1997·Granted Oct 6, 1998·133 cites·19 claims
- 1690US6774315B1Floating interposerIBM·Filed 2000·Granted Aug 10, 2004·43 cites·9 claims
- 1790US6437254B1Apparatus and method for printed circuit board repairIBM·Filed 2001·Granted Aug 20, 2002·46 cites·3 claims
- 1887US6225206B1Flip chip C4 extension structure and processIBM·Filed 1999·Granted May 1, 2001·67 cites·17 claims
- 1987US5545465ACircuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuitsIBM·Filed 1995·Granted Aug 13, 1996·71 cites·17 claims
- 2087US5523696AMethod and apparatus for testing integrated circuit chipsIBM·Filed 1993·Granted Jun 4, 1996·64 cites·7 claims
- 2186US6756680B2Flip chip C4 extension structure and processIBM·Filed 2001·Granted Jun 29, 2004·33 cites·20 claims
- 2286US5565033APressurized injection nozzle for screening pasteIBM·Filed 1995·Granted Oct 15, 1996·67 cites·10 claims
- 2386US5528159AMethod and apparatus for testing integrated circuit chipsIBM·Filed 1995·Granted Jun 18, 1996·63 cites·10 claims
- 2485US6955982B2Flip chip C4 extension structure and processIBM·Filed 2003·Granted Oct 18, 2005·29 cites·21 claims
- 2585US6661661B2Common heatsink for multiple chips and modulesIBM·Filed 2002·Granted Dec 9, 2003·30 cites·7 claims
- 2685US5973389ASemiconductor chip carrier assemblyIBM·Filed 1997·Granted Oct 26, 1999·68 cites·14 claims
- 2785US5478700AMethod for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection headIBM·Filed 1993·Granted Dec 26, 1995·65 cites·21 claims
- 2884US5889321AStiffeners with improved adhesion to flexible substratesIBM·Filed 1997·Granted Mar 30, 1999·75 cites·7 claims
- 2982US5759737AMethod of making a component carrierIBM·Filed 1996·Granted Jun 2, 1998·62 cites·5 claims
- 3080US6150726AComponent carrier with raised bonding sitesIBM·Filed 1998·Granted Nov 21, 2000·51 cites·6 claims
- 3179US6129804ATFT panel alignment and attachment method and apparatusIBM·Filed 1998·Granted Oct 10, 2000·36 cites·34 claims
- 3279US5290992AApparatus for maximizing light beam utilizationIBM·Filed 1992·Granted Mar 1, 1994·35 cites·21 claims
- 3378US7335325B1Formable structure between two objectsPIERSON MARK VINCENT·Filed 2003·Granted Feb 26, 2008·16 cites·10 claims
- 3478US6173887B1Method of making electrically conductive contacts on substratesIBM·Filed 1999·Granted Jan 16, 2001·39 cites·18 claims
- 3578US6100114AEncapsulation of solder bumps and solder connectionsIBM·Filed 1998·Granted Aug 8, 2000·54 cites·14 claims
- 3678US5759269AManufacturing flexible circuit board assemblies and printer for screening solder paste in such manufactureIBM·Filed 1995·Granted Jun 2, 1998·41 cites·4 claims
- 3777US6206997B1Method for bonding heat sinks to overmolds and device formed therebyIBM·Filed 1999·Granted Mar 27, 2001·36 cites·10 claims
- 3877US5862588AMethod for restraining circuit board warp during area array reworkIBM·Filed 1995·Granted Jan 26, 1999·45 cites·6 claims
- 3977US5638597AManufacturing flexible circuit board assemblies with common heat spreadersIBM·Filed 1995·Granted Jun 17, 1997·42 cites·23 claims
- 4075US6179196B1Apparatus for manufacturing circuit boardsIBM·Filed 2000·Granted Jan 30, 2001·19 cites·20 claims
- 4175US5796452ASimplified wiring escape technique for tiled displayIBM·Filed 1997·Granted Aug 18, 1998·47 cites·4 claims
- 4274US6980392B2System and method for capturing contaminants within a disk driveIBM·Filed 2003·Granted Dec 27, 2005·9 cites·18 claims
- 4374US6513701B2Method of making electrically conductive contacts on substratesIBM·Filed 2001·Granted Feb 4, 2003·19 cites·20 claims
- 4473US6569710B1Panel structure with plurality of chip compartments for providing high volume of chip modulesIBM·Filed 1998·Granted May 27, 2003·37 cites·11 claims
- 4573US6252779B1Ball grid array via structureIBM·Filed 1999·Granted Jun 26, 2001·33 cites·30 claims
- 4673US5969945AElectronic package assemblyIBM·Filed 1997·Granted Oct 19, 1999·33 cites·4 claims
- 4772US4030180ALongitudinally fed component insertion apparatusPIERSON MARK V·Filed 1976·Granted Jun 21, 1977·21 cites·14 claims
- 4871US5831828AFlexible circuit board and common heat spreader assemblyIBM·Filed 1993·Granted Nov 3, 1998·32 cites·15 claims
- 4971US5809641AMethod for printed circuit board repairIBM·Filed 1996·Granted Sep 22, 1998·28 cites·6 claims
- 5071US5451131ADockable interface airlock between process enclosure and interprocess transfer containerIBM·Filed 1992·Granted Sep 19, 1995·57 cites·6 claims
Showing the top 50 of 107 patent records by PatentIndex Score.
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