Inventor · disambiguated record
Ying-Chi Hsieh
Also filed as: HSIEH YING-CHI
4 granted patents·1 pending application·6 citations·filing 2010–2013
63Inventor score
Top patents by PatentIndex Score
5 records- 0166US8431835B2Packaging device for an electronic element and method for making the sameCHIANG WEN-CHUNG·Filed 2010·Granted Apr 30, 2013·4 cites·15 claims
- 0259US8549739B2Method of making circuit board moduleCHIANG WEN-CHUNG·Filed 2010·Granted Oct 8, 2013·2 cites·6 claims
- 0345US8898892B2Method of making circuit board moduleTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2013·Granted Dec 2, 2014·0 cites·5 claims
- 0440US8461614B2Packaging substrate device, method for making the packaging substrate device, and packaged light emitting deviceCHIANG WEN-CHUNG·Filed 2010·Granted Jun 11, 2013·0 cites·11 claims
- 0534US2010236819A1Printed circuit board and method for making the sameHIGH CONDUCTION SCIENT CO LTD·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →