Inventor · disambiguated record
Masaya Koda
Also filed as: KODA MASAYA
1 granted patent·2 pending applications·3 citations·filing 2006–2019
22Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0158US8169090B2Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the sameKATSURAYAMA SATORU·Filed 2006·Granted May 1, 2012·3 cites·25 claims
- 0236US2022064402A1Thermosetting resin composition for lds and method for manufacturing semiconductor deviceSUMITOMO BAKELITE CO·Filed 2019·Application pending·0 cites
- 0315US2012126434A1Liquid resin composition and semiconductor device using the sameKODA MASAYA·Filed 2010·Application pending·0 cites
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