Inventor · disambiguated record
Sukhminder S. Binapal
Also filed as: BINAPAL SUKHMINDER · BINAPAL SUKHMINDER S
2 granted patents·3 pending applications·298 citations·filing 1998–2016
62Inventor score
Top patents by PatentIndex Score
5 records- 0191US6133626AThree dimensional packaging configuration for multi-chip module assemblyGENNUM CORP·Filed 1998·Granted Oct 17, 2000·298 cites·19 claims
- 0243US2005090295A1Communication headset with signal processing capabilityGENNUM CORP·Filed 2004·Application pending·0 cites
- 0341US2007041589A1System and method for providing environmental specific noise reduction algorithmsGENNUM CORP·Filed 2005·Application pending·0 cites
- 0435US10468336B2High density semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Nov 5, 2019·0 cites·14 claims
- 0529US2011210411A1Ultra thin flip-chip backside device sensor packageSOUND DESIGN TECHNOLOGIES LTD·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →