Inventor · disambiguated record
Masakazu Ishino
Also filed as: ISHINO MASAKAZU
20 granted patents·4 pending applications·532 citations·filing 1990–2014
96Inventor score
Top patents by PatentIndex Score
24 records- 0196US7576433B2Semiconductor memory device and manufacturing method thereofELPIDA MEMORY INC·Filed 2006·Granted Aug 18, 2009·38 cites·16 claims
- 0291US7638362B2Memory module with improved mechanical strength of chipsELPIDA MEMORY INC·Filed 2006·Granted Dec 29, 2009·22 cites·14 claims
- 0391US5939789AMultilayer substrates methods for manufacturing multilayer substrates and electronic devicesHITACHI LTD·Filed 1997·Granted Aug 17, 1999·128 cites·27 claims
- 0490US8298940B2Semiconductor memory device and manufacturing method thereofISHINO MASAKAZU·Filed 2011·Granted Oct 30, 2012·11 cites·20 claims
- 0589US5886409AElectrode structure of wiring substrate of semiconductor device having expanded pitchHITACHI LTD·Filed 1997·Granted Mar 23, 1999·89 cites·19 claims
- 0688US8704352B2Semiconductor device having a liquid cooling moduleHISANO NAE·Filed 2010·Granted Apr 22, 2014·11 cites·18 claims
- 0785US8513121B2Semiconductor memory device and manufacturing method thereofISHINO MASAKAZU·Filed 2012·Granted Aug 20, 2013·7 cites·20 claims
- 0885US7893540B2Semiconductor memory device and manufacturing method thereofELPIDA MEMORY INC·Filed 2009·Granted Feb 22, 2011·11 cites·19 claims
- 0984US5320729ASputtering targetHITACHI LTD·Filed 1992·Granted Jun 14, 1994·45 cites·18 claims
- 1080US7564127B2Memory module that is capable of controlling input/output in accordance with type of memory chipELPIDA MEMORY INC·Filed 2006·Granted Jul 21, 2009·9 cites·17 claims
- 1180US5498768AProcess for forming multilayer wiringHITACHI LTD·Filed 1993·Granted Mar 12, 1996·60 cites·18 claims
- 1273US7754581B2Method for manufacturing a three-dimensional semiconductor device and a wafer used thereinELPIDA MEMORY INC·Filed 2007·Granted Jul 13, 2010·5 cites·6 claims
- 1369US7791196B2Semiconductor device having a smaller electrostatic capacitance electrodeELPIDA MEMORY INC·Filed 2007·Granted Sep 7, 2010·4 cites·14 claims
- 1469US6137185AElectrode structure of a wiring substrate of semiconductor device having expanded pitchHITACHI LTD·Filed 1999·Granted Oct 24, 2000·30 cites·16 claims
- 1568US8937390B2Semiconductor device having a liquid cooling moduleHISANO NAE·Filed 2014·Granted Jan 20, 2015·2 cites·2 claims
- 1667US5670421AProcess for forming multilayer wiringHITACHI LTD·Filed 1996·Granted Sep 23, 1997·31 cites·9 claims
- 1758US7618847B2Bonding method of semiconductor and laminated structure fabricated therebyELPIDA MEMORY INC·Filed 2008·Granted Nov 17, 2009·1 cites·10 claims
- 1852US5285016AWiring board provided with a heat bypass layerHITACHI LTD·Filed 1990·Granted Feb 8, 1994·22 cites·21 claims
- 1950US8334465B2Wafer of circuit board and joining structure of wafer or circuit boardISHINO MASAKAZU·Filed 2008·Granted Dec 18, 2012·0 cites·24 claims
- 2049US2013140067A1Wafer or circuit board and joining structure of wafer or circuit boardELPIDA MEMORY INC·Filed 2012·Application pending·0 cites
- 2146US2009134498A1Semiconductor apparatusELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 2245US2008136024A1Semiconductor deviceELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 2344US2008009124A1Method of forming a semiconductor deviceISHINO MASAKAZU·Filed 2007·Application pending·0 cites
- 2439US5235313AThin film resistor and wiring board using the sameHITACHI LTD·Filed 1991·Granted Aug 10, 1993·6 cites·14 claims
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