Inventor · disambiguated record
Su-Ho Shin
Also filed as: SHIN SU-HO
39 granted patents·11 pending applications·379 citations·filing 2000–2014
98Inventor score
Top patents by PatentIndex Score
50 records- 0198US8032069B2Fusing device and image forming apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Oct 4, 2011·38 cites·22 claims
- 0298US7881650B2Fusing device and image forming apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 1, 2011·35 cites·40 claims
- 0395US7773931B2Fusing device and image forming apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 10, 2010·21 cites·20 claims
- 0494US7792476B2Fusing apparatus and electrophotographic image-forming apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Sep 7, 2010·20 cites·18 claims
- 0593US7623817B2Fixing device and image forming apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 24, 2009·15 cites·32 claims
- 0690US8150305B2Fusing device and image forming apparatus having the sameSHIN SU HO·Filed 2009·Granted Apr 3, 2012·12 cites·25 claims
- 0790US7821027B2LED package structure and manufacturing method, and LED array moduleSAMSUNG LED CO LTD·Filed 2006·Granted Oct 26, 2010·17 cites·23 claims
- 0890US7553047B2Lighting deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 30, 2009·51 cites·15 claims
- 0990US7334335B2Method of manufacturing a monolithic ink-jet printheadSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 26, 2008·10 cites·20 claims
- 1089US7537319B2Piezoelectric inkjet printhead and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 26, 2009·11 cites·30 claims
- 1189US7514718B2LED package, manufacturing method thereof, and LED array module using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 7, 2009·18 cites·20 claims
- 1288US7664448B2Apparatus and method of heating image on recordable materialSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 16, 2010·9 cites·30 claims
- 1386US8909118B2Fusing device and image forming device comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 9, 2014·4 cites·18 claims
- 1486US7773930B2Fixing device and image forming apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 10, 2010·8 cites·29 claims
- 1586US7769333B2Fusing device and image forming apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 3, 2010·8 cites·24 claims
- 1678US7368063B2Method for manufacturing ink-jet printheadSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 6, 2008·4 cites·20 claims
- 1777US7465404B2Ink-jet printhead and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 16, 2008·4 cites·15 claims
- 1874US7497559B2Piezoelectric inkjet printhead and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 3, 2009·4 cites·20 claims
- 1974US6561631B2Ink jet printer headSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 13, 2003·15 cites·15 claims
- 2073US7928545B2LED package and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 19, 2011·5 cites·13 claims
- 2173US7207662B2Ink-jet printheadSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 24, 2007·14 cites·19 claims
- 2273US7069656B2Methods for manufacturing monolithic ink-jet printheadsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 4, 2006·3 cites·27 claims
- 2366US8334585B2LED package and fabrication method thereofKWON KI-HWAN·Filed 2011·Granted Dec 18, 2012·2 cites·20 claims
- 2466US7470001B2Thermal inkjet printhead apparatus to regulate pressure exerted by bubbles in an ink chamber and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 30, 2008·2 cites·27 claims
- 2565US8002443B2LED array moduleSAMSUNG LED CO LTD·Filed 2006·Granted Aug 23, 2011·4 cites·6 claims
- 2663US8162471B2Image forming element and manufacturing method thereofSHIN SU HO·Filed 2007·Granted Apr 24, 2012·2 cites·32 claims
- 2763US7032231B2Optical pickup deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 18, 2006·5 cites·8 claims
- 2862US7178905B2Monolithic ink-jet printheadSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 20, 2007·9 cites·22 claims
- 2962US6345883B1Ink jetting apparatus with finsSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 12, 2002·10 cites·14 claims
- 3058US7668495B2Apparatus and method of heating image on recordable materialSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 23, 2010·1 cites·7 claims
- 3158US6984024B2Monolithic ink-jet printhead having an ink chamber defined by a barrier wall and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 10, 2006·6 cites·21 claims
- 3253US7036913B2Ink-jet printheadSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 2, 2006·4 cites·10 claims
- 3349US6979076B2Ink-jet printheadSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 27, 2005·3 cites·9 claims
- 3447US2006238575A1Monolithic ink-jet printhead having a metal nozzle plate and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3545US8630571B2Reduced thickness fixing unit to reduce deformation or fatigue failureJUNG YOUN-GUN·Filed 2011·Granted Jan 14, 2014·0 cites·15 claims
- 3645US8592231B2LED package structure and manufacturing method, and LED array moduleSHIN SU-HO·Filed 2010·Granted Nov 26, 2013·0 cites·18 claims
- 3745US7535446B2Liquid crystal on silicon (LCOS) display device having a uniform cell gapSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 19, 2009·1 cites·7 claims
- 3845US7073891B2Monolithic ink-jet printhead having a metal nozzle plate and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 11, 2006·2 cites·18 claims
- 3944US7741774B2Backlight module including at least one luminescence element, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 22, 2010·0 cites·9 claims
- 4044US2006216725A1Polymer chain reaction apparatus using marangoni convection and polymer chain reaction method using the sameLEE YOU-SEOP·Filed 2005·Application pending·0 cites
- 4143US6494564B2Print array head and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 17, 2002·2 cites·18 claims
- 4243US2007194336A1Light emitting device package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4342US2007029570A1LED package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4442US2004146409A1Micro-pump driven by phase change of a fluidFiled 2004·Application pending·0 cites
- 4541US2008317528A1Fusing device, image forming apparatus having the fusing device, and fusing method of the image forming apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4640US2008240807A1Belt meander preventing device, fixing device and image forming apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4740US2008138131A1Fusing device and image forming apparatus comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4839US2015037077A1Image fixing device and image forming apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 4939US2008136889A1Image forming element and its manufacturing apparatus and methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 5038US2008252712A1Image forming element and fabricating method thereof, and image forming apparatus having the image forming elementSHIN SU-HO·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →