Inventor · disambiguated record
Hsin-Fu Chuang
Also filed as: CHUANG HSIN-FU
2 granted patents·1 pending application·4 citations·filing 2004–2007
45Inventor score
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
3 records- 0148US7728441B2Method for mounting a semiconductor package onto PCBADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jun 1, 2010·0 cites·3 claims
- 0247US7357294B2Method for mounting a semiconductor package onto PCBADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 15, 2008·4 cites·11 claims
- 0334US2005087864A1Cavity-down semiconductor package with heat spreaderADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →