Inventor · disambiguated record
Tue Nguyen
Also filed as: NGUYEN TUE · NGUYEN TUE H
105 granted patents·33 pending applications·7,195 citations·filing 1990–2021
99Inventor score
Files withTEGAL CORP26SHARP LAB OF AMERICA INC23SIMPLUS SYSTEMS CORP14SHARP MICROELECT TECH INC10KUMAR ANANDA H9
Top patents by PatentIndex Score
138 records- 0199US7425224B2High pressure chemical vapor trapping methodTEGAL CORP·Filed 2005·Granted Sep 16, 2008·379 cites·9 claims
- 0299US7163721B2Method to plasma deposit on organic polymer dielectric filmTEGAL CORP·Filed 2003·Granted Jan 16, 2007·531 cites·17 claims
- 0399US7153542B2Assembly line processing methodTEGAL CORP·Filed 2002·Granted Dec 26, 2006·650 cites·27 claims
- 0499US6756318B2Nanolayer thick film processing system and methodTEGAL CORP·Filed 2001·Granted Jun 29, 2004·650 cites·20 claims
- 0599US6689220B1Plasma enhanced pulsed layer depositionSIMPLUS SYSTEMS CORP·Filed 2000·Granted Feb 10, 2004·658 cites·10 claims
- 0698US9997353B1Silicon composite substratesKUMAR ANANDA H·Filed 2017·Granted Jun 12, 2018·28 cites·11 claims
- 0798US6565661B1High flow conductance and high thermal conductance showerhead system and methodSIMPLUS SYSTEMS CORP·Filed 1999·Granted May 20, 2003·307 cites·11 claims
- 0898US6444039B1Three-dimensional showerhead apparatusSIMPLUS SYSTEMS CORP·Filed 2000·Granted Sep 3, 2002·326 cites·11 claims
- 0998US5904565ALow resistance contact between integrated circuit metal levels and method for sameSHARP MICROELECT TECH INC·Filed 1997·Granted May 18, 1999·302 cites·19 claims
- 1098US5897379ALow temperature system and method for CVD copper removalSHARP MICROELECT TECH INC·Filed 1997·Granted Apr 27, 1999·404 cites·20 claims
- 1197US9708707B2Nanolayer deposition using bias power treatmentDITIZIO ROBERT ANTHONY·Filed 2010·Granted Jul 18, 2017·464 cites·35 claims
- 1297US7713592B2Nanolayer deposition processTEGAL CORP·Filed 2003·Granted May 11, 2010·116 cites·13 claims
- 1396US10751951B13-D printed materials, structures and processesNGUYEN TAI DUNG·Filed 2014·Granted Aug 25, 2020·32 cites·16 claims
- 1495US7235484B2Nanolayer thick film processing system and methodTEGAL CORP·Filed 2004·Granted Jun 26, 2007·55 cites·27 claims
- 1595US5468687AMethod of making TA2 O5 thin film by low temperature ozone plasma annealing (oxidation)IBM·Filed 1994·Granted Nov 21, 1995·129 cites·5 claims
- 1694US6777331B2Multilayered copper structure for improving adhesion propertySIMPLUS SYSTEMS CORP·Filed 2002·Granted Aug 17, 2004·67 cites·22 claims
- 1794US5939334ASystem and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxidesSHARP LAB OF AMERICA INC·Filed 1997·Granted Aug 17, 1999·126 cites·9 claims
- 1893US7141348B2Lamination and delamination technique for thin film processingINTELLEFLEX CORP·Filed 2003·Granted Nov 28, 2006·33 cites·21 claims
- 1992US7442615B2Semiconductor processing system and methodTEGAL CORP·Filed 2006·Granted Oct 28, 2008·18 cites·20 claims
- 2092US6440878B1Method to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbon using a silicon carbide adhesion promoter layerSHARP LAB OF AMERICA INC·Filed 2000·Granted Aug 27, 2002·43 cites·11 claims
- 2192US5330935ALow temperature plasma oxidation processIBM·Filed 1992·Granted Jul 19, 1994·151 cites·10 claims
- 2291US11161298B2Systems and methods for 3D printing with multiple exchangeable printheadsGIFFORD KARL JOSEPH·Filed 2017·Granted Nov 2, 2021·6 cites·15 claims
- 2391US9698176B1Silicon-based backplane structures and methods for display applicationsKUMAR ANANDA H·Filed 2014·Granted Jul 4, 2017·10 cites·20 claims
- 2491US8658259B2Nanolayer deposition processNGUYEN TUE·Filed 2010·Granted Feb 25, 2014·5 cites·10 claims
- 2591US6572706B1Integrated precursor delivery systemSIMPLUS SYSTEMS CORP·Filed 2000·Granted Jun 3, 2003·39 cites·16 claims
- 2691US5821169AHard mask method for transferring a multi-level photoresist patternSHARP MICROELECT TECH INC·Filed 1996·Granted Oct 13, 1998·128 cites·22 claims
- 2790US10137642B1Methods to form 3D objects using cross-linkable or sinterable materialsGIFFORD KARL JOSEPH·Filed 2015·Granted Nov 27, 2018·13 cites·20 claims
- 2890US5936707AMulti-level reticle system and method for forming multi-level resist profilesSHARP LAB OF AMERICA INC·Filed 1998·Granted Aug 10, 1999·63 cites·21 claims
- 2990US5906910AMulti-level photoresist profile methodSHARP KK·Filed 1998·Granted May 25, 1999·65 cites·3 claims
- 3089US9224904B1Composite substrates of silicon and ceramicKUMAR ANANDA·Filed 2012·Granted Dec 29, 2015·15 cites·10 claims
- 3188US7867905B2System and method for semiconductor processingTEGAL CORP·Filed 2006·Granted Jan 11, 2011·13 cites·20 claims
- 3287US6946178B2Lamination and delamination technique for thin film processingSHEATS JAMES·Filed 2003·Granted Sep 20, 2005·38 cites·23 claims
- 3387US5412246ALow temperature plasma oxidation processIBM·Filed 1994·Granted May 2, 1995·93 cites·8 claims
- 3486US6610169B2Semiconductor processing system and methodSIMPLUS SYSTEMS CORP·Filed 2001·Granted Aug 26, 2003·29 cites·17 claims
- 3585US6630396B2Use of a silicon carbide adhesion promoter layer to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbonSHARP LAB OF AMERICA INC·Filed 2002·Granted Oct 7, 2003·23 cites·9 claims
- 3685US6495449B1Multilayered diffusion barrier structure for improving adhesion propertySIMPLUS SYSTEMS CORP·Filed 2000·Granted Dec 17, 2002·38 cites·24 claims
- 3784US6440219B1Replaceable shielding apparatusSIMPLUS SYSTEMS CORP·Filed 2000·Granted Aug 27, 2002·19 cites·2 claims
- 3883US10926527B23D printer systems and methodsGIFFORD KARL JOSEPH DODDS·Filed 2017·Granted Feb 23, 2021·2 cites·16 claims
- 3983US5914202AMethod for forming a multi-level reticleSHARP MICROELETRONICS TECHNOLO·Filed 1996·Granted Jun 22, 1999·49 cites·6 claims
- 4081US9121098B2NanoLayer Deposition process for composite filmsDITIZIO ROBERT ANTHONY·Filed 2011·Granted Sep 1, 2015·2 cites·35 claims
- 4181US5744192AMethod of using water vapor to increase the conductivity of cooper desposited with cu(hfac)TMVSSHARP MICROELECT TECH INC·Filed 1996·Granted Apr 28, 1998·54 cites·26 claims
- 4280US9447496B2Nanolayer deposition processNGUYEN TUE·Filed 2012·Granted Sep 20, 2016·1 cites·21 claims
- 4380US8940374B2Nanolayer deposition processNGUYEN TUE·Filed 2012·Granted Jan 27, 2015·1 cites·4 claims
- 4480US7361387B2Plasma enhanced pulsed layer depositionTEGAL CORP·Filed 2003·Granted Apr 22, 2008·17 cites·12 claims
- 4580US5945402AHuman relaxin formulationGENENTECH INC·Filed 1995·Granted Aug 31, 1999·30 cites·16 claims
- 4679US6221166B1Multi-thermal zone shielding apparatusSIMPLUS SYSTEMS CORP·Filed 2000·Granted Apr 24, 2001·18 cites·11 claims
- 4778US6488272B1Liquid delivery system emulsifierSIMPLUS SYSTEMS CORP·Filed 2000·Granted Dec 3, 2002·16 cites·20 claims
- 4876US6858085B1Two-compartment chamber for sequential processingTEGAL CORP·Filed 2002·Granted Feb 22, 2005·18 cites·34 claims
- 4976US6020639ASemiconductor wafer with removed CVD copperSHARP LAB OF AMERICA INC·Filed 1998·Granted Feb 1, 2000·41 cites·8 claims
- 5076US5948467AEnhanced CVD copper adhesion by two-step deposition processSHARP LAB OF AMERICA INC·Filed 1998·Granted Sep 7, 1999·50 cites·10 claims
Showing the top 50 of 138 patent records by PatentIndex Score.
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