Inventor · disambiguated record
Brian J. O'Hara
Also filed as: O'HARA BRIAN J
2 granted patents·3 citations·filing 2006–2012
43Inventor score
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2 records- 0163US8342383B2Method for forming sputter target assemblies having a controlled solder thicknessPRAXAIR TECHNOLOGY INC·Filed 2006·Granted Jan 1, 2013·3 cites·13 claims
- 0248US8993122B2Method for forming sputter target assemblies having a controlled solder thicknessGILMAN PAUL S·Filed 2012·Granted Mar 31, 2015·0 cites·15 claims
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