Inventor · disambiguated record
John Hoang
Also filed as: HOANG JOHN · HOANG JOHN D · HOANG JOHN DINH
20 granted patents·9 pending applications·122 citations·filing 1993–2025
93Inventor score
Files withLAM RES CORP15NORFOLK SOUTHERN CORP5AEHR TEST SYSTEMS4HOANG SHERYLINN3AEHR TEST SYSTEMS INC1
Top patents by PatentIndex Score
29 records- 0198US9870899B2Cobalt etch backLAM RES CORP·Filed 2015·Granted Jan 16, 2018·32 cites·19 claims
- 0294US10784086B2Cobalt etch backLAM RES CORP·Filed 2017·Granted Sep 22, 2020·9 cites·14 claims
- 0385US12365373B2Undercarriage inspection assemblies and systemsNORFOLK SOUTHERN CORP·Filed 2024·Granted Jul 22, 2025·0 cites·17 claims
- 0485US12348880B2Rail-side inspection assemblies and systemsNORFOLK SOUTHERN CORP·Filed 2024·Granted Jul 1, 2025·0 cites·22 claims
- 0584US2025319913A1Undercarriage inspection assemblies and systemsNORFOLK SOUTHERN CORP·Filed 2025·Application pending·0 cites
- 0684US2025326411A1Undercarriage inspection assemblies systemsNORFOLK SOUTHERN CORP·Filed 2025·Application pending·0 cites
- 0782US2025282401A1Rail-side inspection assemblies and systemsNORFOLK SOUTHERN CORP·Filed 2025·Application pending·0 cites
- 0879US11723998B1Automated robotic system and method for sanitization and disinfectionHOANG SHERYLINN·Filed 2020·Granted Aug 15, 2023·1 cites·1 claims
- 0979US11511008B2Automated robotic system and method for sanitization and disinfectionH7 TECH INC·Filed 2021·Granted Nov 29, 2022·1 cites·7 claims
- 1079US2025090708A1Automated Robotic System And Method For Sanitization And DisinfectionHOANG SHERYLINN·Filed 2024·Application pending·0 cites
- 1177US12201740B2Automated robotic system and method for sanitization and disinfectionHOANG SHERYLINN·Filed 2023·Granted Jan 21, 2025·0 cites·1 claims
- 1277US10199235B2Liner and barrier applications for subtractive metal integrationLAM RES CORP·Filed 2018·Granted Feb 5, 2019·2 cites·12 claims
- 1372US11239420B2Conformal damage-free encapsulation of chalcogenide materialsLAM RES CORP·Filed 2018·Granted Feb 1, 2022·1 cites·17 claims
- 1472US9570320B2Method to etch copper barrier filmLAM RES CORP·Filed 2014·Granted Feb 14, 2017·3 cites·22 claims
- 1571US6562636B1Wafer level burn-in and electrical test system and methodAEHR TEST SYSTEMS·Filed 1999·Granted May 13, 2003·26 cites·7 claims
- 1671US2024387258A1Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2024·Application pending·0 cites
- 1769US6682945B2Wafer level burn-in and electrical test system and methodAEHR TEST SYSTEMS·Filed 2001·Granted Jan 27, 2004·10 cites·21 claims
- 1869US5429510AHigh-density interconnect techniqueAEHR TEST SYSTEMS INC·Filed 1993·Granted Jul 4, 1995·34 cites·12 claims
- 1966US11832533B2Conformal damage-free encapsulation of chalcogenide materialsLAM RES CORP·Filed 2021·Granted Nov 28, 2023·0 cites·15 claims
- 2063US9899234B2Liner and barrier applications for subtractive metal integrationLAM RES CORP·Filed 2014·Granted Feb 20, 2018·1 cites·17 claims
- 2155US11792987B2Self-aligned vertical integration of three-terminal memory devicesLAM RES CORP·Filed 2019·Granted Oct 17, 2023·0 cites·31 claims
- 2254US12080592B2Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2019·Granted Sep 3, 2024·0 cites·8 claims
- 2353US2024381790A1Techniques and apparatuses for processing chalcogenidesLAM RES CORP·Filed 2022·Application pending·0 cites
- 2452US2025118568A1Reduced temperature etching of doped silicon oxideLAM RES CORP·Filed 2023·Application pending·0 cites
- 2550US2025308894A1Hardmask for high aspect ratio dielectric etch at cryo and elevated temperaturesLAM RES CORP·Filed 2023·Application pending·0 cites
- 2648US7928754B2Wafer level burn-in and electrical test system and methodAEHR TEST SYSTEMS·Filed 2009·Granted Apr 19, 2011·0 cites·5 claims
- 2746US7619428B2Wafer level burn-in and electrical test system and methodAEHR TEST SYSTEMS·Filed 2003·Granted Nov 17, 2009·2 cites·1 claims
- 2844US9589853B2Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamberLAM RES CORP·Filed 2014·Granted Mar 7, 2017·0 cites·20 claims
- 2943US2023143057A1Protection of channel layer in three-terminal vertical memory structureLAM RES CORP·Filed 2021·Application pending·0 cites
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